5SGXMBBR2H43C2N

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA

Quantity 700 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMBBR2H43C2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 I/O, ~53.2 Mbits RAM, 952,000 Logic Elements, 1760-BBGA

The 5SGXMBBR2H43C2N is a Stratix® V GX family FPGA provided in a 1760-ball BGA (FCBGA) package and targeted at commercial-temperature applications. It integrates approximately 952,000 logic elements and approximately 53.2 Mbits of embedded RAM to support high-density, logic- and memory-intensive designs.

With 600 I/O, a surface-mount 1760-HBGA (45×45) package option, a core voltage supply range of 870 mV to 930 mV, and a commercial operating range of 0 °C to 85 °C, this device is suited to systems that require large programmable logic capacity and extensive I/O integration while meeting RoHS compliance requirements.

Key Features

  • Core Logic  Approximately 952,000 logic elements provide extensive programmable logic capacity for complex FPGA designs.
  • Embedded Memory  Approximately 53.2 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
  • I/O Density  600 general-purpose I/O pins to support wide parallel interfaces, multiple buses, and mixed-signal front-end connectivity.
  • Power Supply  Core voltage supply range of 870 mV to 930 mV for specified operating conditions.
  • Package & Mounting  1760-ball BGA (FCBGA) surface-mount package; supplier device package listed as 1760-HBGA (45×45) for compact, high-density board integration.
  • Temperature Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
  • Standards Compliance  RoHS compliant.

Typical Applications

  • High-density digital processing  Use where large amounts of programmable logic and embedded RAM are required for signal processing, algorithm implementation, or large finite-state machines.
  • Wide-parallel interfacing  Systems needing many external interfaces or parallel buses benefit from the device’s 600 I/O pins for direct connectivity and board-level consolidation.
  • System integration and prototyping  Ideal for consolidating functions into a single FPGA for proof-of-concept, prototype development, and integration of multiple IP blocks.

Unique Advantages

  • Extensive logic capacity: Approximately 952,000 logic elements enable complex designs to be implemented on a single device, reducing multi-chip coordination.
  • Significant on-chip RAM: Approximately 53.2 Mbits of embedded memory supports large buffering and local data storage without external memory dependency.
  • High I/O count: 600 I/O pins provide flexibility to interface with numerous peripherals and parallel data paths, simplifying board-level routing.
  • Compact BGA packaging: The 1760-ball BGA (45×45) package allows high-pin-count integration in a space-efficient form factor for dense PCB designs.
  • Commercial temperature rating: Specified operation from 0 °C to 85 °C for use in standard commercial environments.
  • RoHS compliant: Meets environmental requirements for lead-free manufacturing processes.

Why Choose 5SGXMBBR2H43C2N?

The 5SGXMBBR2H43C2N positions itself as a high-capacity Stratix V GX FPGA option for designers who need a large pool of programmable logic, substantial embedded RAM, and broad I/O integration in a single commercial-grade device. Its combination of nearly one million logic elements, tens of megabits of on-chip memory, and a 1760-ball BGA package supports consolidation of complex system functions onto a single FPGA footprint.

This device is appropriate for engineering teams building compute- and I/O-intensive systems that require dense integration and long-term scalability, while adhering to RoHS requirements and commercial temperature constraints.

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