5SGXMBBR2H43C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 700 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMBBR2H43C2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 I/O, ~53.2 Mbits RAM, 952,000 Logic Elements, 1760-BBGA
The 5SGXMBBR2H43C2N is a Stratix® V GX family FPGA provided in a 1760-ball BGA (FCBGA) package and targeted at commercial-temperature applications. It integrates approximately 952,000 logic elements and approximately 53.2 Mbits of embedded RAM to support high-density, logic- and memory-intensive designs.
With 600 I/O, a surface-mount 1760-HBGA (45×45) package option, a core voltage supply range of 870 mV to 930 mV, and a commercial operating range of 0 °C to 85 °C, this device is suited to systems that require large programmable logic capacity and extensive I/O integration while meeting RoHS compliance requirements.
Key Features
- Core Logic Approximately 952,000 logic elements provide extensive programmable logic capacity for complex FPGA designs.
- Embedded Memory Approximately 53.2 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
- I/O Density 600 general-purpose I/O pins to support wide parallel interfaces, multiple buses, and mixed-signal front-end connectivity.
- Power Supply Core voltage supply range of 870 mV to 930 mV for specified operating conditions.
- Package & Mounting 1760-ball BGA (FCBGA) surface-mount package; supplier device package listed as 1760-HBGA (45×45) for compact, high-density board integration.
- Temperature Grade Commercial-grade device rated for 0 °C to 85 °C operation.
- Standards Compliance RoHS compliant.
Typical Applications
- High-density digital processing Use where large amounts of programmable logic and embedded RAM are required for signal processing, algorithm implementation, or large finite-state machines.
- Wide-parallel interfacing Systems needing many external interfaces or parallel buses benefit from the device’s 600 I/O pins for direct connectivity and board-level consolidation.
- System integration and prototyping Ideal for consolidating functions into a single FPGA for proof-of-concept, prototype development, and integration of multiple IP blocks.
Unique Advantages
- Extensive logic capacity: Approximately 952,000 logic elements enable complex designs to be implemented on a single device, reducing multi-chip coordination.
- Significant on-chip RAM: Approximately 53.2 Mbits of embedded memory supports large buffering and local data storage without external memory dependency.
- High I/O count: 600 I/O pins provide flexibility to interface with numerous peripherals and parallel data paths, simplifying board-level routing.
- Compact BGA packaging: The 1760-ball BGA (45×45) package allows high-pin-count integration in a space-efficient form factor for dense PCB designs.
- Commercial temperature rating: Specified operation from 0 °C to 85 °C for use in standard commercial environments.
- RoHS compliant: Meets environmental requirements for lead-free manufacturing processes.
Why Choose 5SGXMBBR2H43C2N?
The 5SGXMBBR2H43C2N positions itself as a high-capacity Stratix V GX FPGA option for designers who need a large pool of programmable logic, substantial embedded RAM, and broad I/O integration in a single commercial-grade device. Its combination of nearly one million logic elements, tens of megabits of on-chip memory, and a 1760-ball BGA package supports consolidation of complex system functions onto a single FPGA footprint.
This device is appropriate for engineering teams building compute- and I/O-intensive systems that require dense integration and long-term scalability, while adhering to RoHS requirements and commercial temperature constraints.
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