5SGXMBBR2H40I3N

The 5SGXMBBR2H40I3N is an Intel Stratix® V GX field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers very high logic density, substantial on-chip embedded memory, and a large I/O complement for complex, high-integration designs.

Designed and graded for industrial use, this device is suitable for systems that require abundant programmable logic, extensive embedded RAM, and wide I/O capability while operating across an extended temperature range.

Key Features

• Core Logic Density — 952,000 logic elements available for implementing complex digital functions and large-scale designs.
• Embedded Memory — approximately 53.248 Mbits of on-chip RAM to support buffering, large state machines, and data-intensive logic.
• I/O Capacity — 696 I/O pins to enable extensive board-level interfacing and system integration.
• Power Supply — core voltage supply range of 820 mV to 880 mV to match targeted power-domain requirements.
• Package & Mounting — 1517-BBGA FCBGA package; supplier device package specified as 1517-HBGA (45 × 45); surface-mount mounting type.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding ambient conditions.
• Compliance — RoHS-compliant device for regulatory environmental requirements.

Typical Applications

• High-density digital processing — Implement large-scale custom logic, algorithm acceleration, and complex finite-state machines using 952,000 logic elements and abundant embedded RAM.
• High-I/O systems — Support for 696 I/Os enables extensive connectivity for board-level peripherals, multi-lane interfaces, and system-level integration.
• Industrial control and instrumentation — Industrial-grade temperature range (−40 °C to 100 °C) and RoHS compliance make this device suitable for industrial environments and equipment.

Unique Advantages

• Very high logic capacity: 952,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity.
• Large on-chip memory: Approximately 53.248 Mbits of embedded RAM minimizes external memory dependency and improves throughput for data-intensive tasks.
• Extensive I/O: 696 I/Os provide flexibility for dense connectivity, reducing the need for external multiplexing or expansion devices.
• Industrial robustness: Wide operating temperature range supports deployment in harsh or temperature-variable environments.
• Compact high-pin package: 1517-BBGA / 1517-HBGA (45 × 45) package combines high pin count with a surface-mount footprint for board-level density.
• Regulatory readiness: RoHS compliance helps simplify environmental regulatory considerations for product development.

Why Choose 5SGXMBBR2H40I3N?

The 5SGXMBBR2H40I3N positions itself as a high-density, industrial-grade Stratix® V GX FPGA suitable for engineers building complex, I/O-heavy systems that require significant on-chip memory and logic. Its combination of 952,000 logic elements, approximately 53.248 Mbits of embedded RAM, and 696 I/Os supports consolidation of multiple subsystems into a single programmable device.

Backed by Intel’s Stratix V family documentation and supplied in a high-pin-count BGA package, this device is intended for designs where integration, scalability, and operational robustness matter. It is a strong fit for teams focused on reducing BOM count, minimizing external memory, and achieving dense board-level implementations in industrial environments.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMBBR2H40I3N. Technical documentation is available in the Stratix V device datasheet for detailed electrical and operating specifications.