5SGXMBBR2H43C2LN

The 5SGXMBBR2H43C2LN is a Stratix V GX class Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1760-ball BGA package. It provides very large logic capacity and on-chip memory along with a high I/O count for dense, system‑level FPGA implementations.

Designed for commercial temperature operation, this device targets high-density digital designs that require substantial programmable logic, embedded RAM, and broad I/O integration while operating within a low core voltage range.

Key Features

• Large Logic Capacity — 952,000 logic elements (LEs) to implement complex digital designs and large-scale programmable logic.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM for buffering, state storage, and data-intensive functions.
• High I/O Count — 600 I/O pins to support wide parallel interfaces and dense board-level connectivity.
• Package and Mounting — 1760‑BBGA FCBGA package (supplier device package: 1760‑HBGA, 45×45) with surface-mount mounting for compact board integration.
• Power and Core Voltage — Core supply voltage specified at 820 mV to 880 mV for the device core domain.
• Operating Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large-scale finite-state machines, datapath logic, and custom accelerators using the abundant logic elements and embedded RAM.
• Networking and communications hardware — Use the high I/O count and large logic fabric for packet processing, protocol bridging, and interface aggregation.
• Signal processing subsystems — Leverage on-chip memory and logic resources for buffering, filtering, and real‑time data manipulation.
• Complex prototyping and system integration — Integrate multiple subsystems on a single FPGA for proof-of-concept and pre-production validation with high pin-count board designs.

Unique Advantages

• Substantial programmable capacity: 952,000 logic elements enable implementation of large, multi-module digital systems without immediate need for multiple devices.
• Significant on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces external memory dependencies and simplifies board-level design.
• Extensive I/O: 600 I/Os provide flexibility for wide parallel buses, multiple interfaces, and high-density connectivity on a single package.
• Compact BGA packaging: 1760‑ball BGA (45×45 HBGA footprint) balances high I/O density with surface-mount assembly for space-constrained PCBs.
• Commercial-grade operation: Specified 0 °C to 85 °C operating range suitable for mainstream electronic products and systems.
• RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose 5SGXMBBR2H43C2LN?

The 5SGXMBBR2H43C2LN delivers a combination of very high logic density, large on-chip memory, and a broad I/O complement in a single commercial‑grade Stratix V GX FPGA. It is a suitable choice for designers who need to consolidate complex digital functions and high‑bandwidth interfaces into a compact surface‑mount package while operating within a low core-voltage domain.

As a member of the Stratix V family, this device is supported by available device documentation and datasheet information, helping teams evaluate electrical characteristics, operating conditions, and package details for system-level integration and long-term deployment.

Request a quote or submit a pricing inquiry for the 5SGXMBBR2H43C2LN to get lead-time and availability information tailored to your design needs.