5SGXMBBR2H43I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 870 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMBBR2H43I2G – Stratix V GX FPGA, 952,000 logic elements, 1760-BBGA
The 5SGXMBBR2H43I2G is a Stratix® V GX field programmable gate array (FPGA) from Intel, built for high-density, industrial-grade system designs. This device delivers a large logic resource pool and substantial on-chip memory, supporting complex digital processing and large-scale integration in embedded systems.
As a member of the Stratix V GX family, the device is provided within the family framework described in the Stratix V datasheet, which documents industrial temperature grades and transceiver speed-grade offerings for the family.
Key Features
- Logic Capacity — Approximately 952,000 logic elements with 359,200 logic blocks, enabling extensive programmable logic and complex SoC integration.
- Embedded Memory — Approximately 53.248 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
- I/O Resources — 600 user I/O pins to support wide peripheral and interface connectivity.
- Power Supply — Core voltage supply range of 870 mV to 930 mV for core power planning and regulator selection.
- Package & Mounting — 1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45), surface-mountable for modern PCB assembly flows.
- Temperature Grade — Industrial operating range from −40 °C to 100 °C for demanding environmental conditions.
- Compliance — RoHS-compliant construction.
Unique Advantages
- High logic density: The nearly one-million logic elements support complex finite state machines, large datapaths, and extensive custom accelerators without external logic.
- Significant on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces dependency on external memory for many buffering and intermediate-storage needs.
- Extensive I/O: 600 I/O pins provide flexibility for multi-protocol interfacing and large connector or mezzanine implementations.
- Industrial robustness: Rated for −40 °C to 100 °C operation, suitable for systems that require a wider temperature envelope.
- High-density package: 1760-BBGA/1760-HBGA packaging enables compact PCB implementations while preserving routing resources for complex designs.
- Regulated core voltage range: Narrow 870–930 mV core supply simplifies power-supply specification and thermal planning.
Why Choose 5SGXMBBR2H43I2G?
The 5SGXMBBR2H43I2G positions itself as a high-resource Stratix V GX FPGA for industrial applications that require large programmable logic capacity, substantial embedded memory, and broad I/O. Its package and surface-mount form factor make it suitable for compact, high-performance boards where integration density and thermal/power planning are critical.
Designed within the Stratix V GX family, this device provides designers with the raw resources needed for complex digital signal processing, protocol aggregation, and large-scale control or acceleration tasks, while conforming to industrial temperature and RoHS requirements.
Request a quote or submit a pricing inquiry to evaluate 5SGXMBBR2H43I2G for your next design project.

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