5SGXMBBR2H43I2G

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA

Quantity 870 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMBBR2H43I2G – Stratix V GX FPGA, 952,000 logic elements, 1760-BBGA

The 5SGXMBBR2H43I2G is a Stratix® V GX field programmable gate array (FPGA) from Intel, built for high-density, industrial-grade system designs. This device delivers a large logic resource pool and substantial on-chip memory, supporting complex digital processing and large-scale integration in embedded systems.

As a member of the Stratix V GX family, the device is provided within the family framework described in the Stratix V datasheet, which documents industrial temperature grades and transceiver speed-grade offerings for the family.

Key Features

  • Logic Capacity — Approximately 952,000 logic elements with 359,200 logic blocks, enabling extensive programmable logic and complex SoC integration.
  • Embedded Memory — Approximately 53.248 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
  • I/O Resources — 600 user I/O pins to support wide peripheral and interface connectivity.
  • Power Supply — Core voltage supply range of 870 mV to 930 mV for core power planning and regulator selection.
  • Package & Mounting — 1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45), surface-mountable for modern PCB assembly flows.
  • Temperature Grade — Industrial operating range from −40 °C to 100 °C for demanding environmental conditions.
  • Compliance — RoHS-compliant construction.

Unique Advantages

  • High logic density: The nearly one-million logic elements support complex finite state machines, large datapaths, and extensive custom accelerators without external logic.
  • Significant on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces dependency on external memory for many buffering and intermediate-storage needs.
  • Extensive I/O: 600 I/O pins provide flexibility for multi-protocol interfacing and large connector or mezzanine implementations.
  • Industrial robustness: Rated for −40 °C to 100 °C operation, suitable for systems that require a wider temperature envelope.
  • High-density package: 1760-BBGA/1760-HBGA packaging enables compact PCB implementations while preserving routing resources for complex designs.
  • Regulated core voltage range: Narrow 870–930 mV core supply simplifies power-supply specification and thermal planning.

Why Choose 5SGXMBBR2H43I2G?

The 5SGXMBBR2H43I2G positions itself as a high-resource Stratix V GX FPGA for industrial applications that require large programmable logic capacity, substantial embedded memory, and broad I/O. Its package and surface-mount form factor make it suitable for compact, high-performance boards where integration density and thermal/power planning are critical.

Designed within the Stratix V GX family, this device provides designers with the raw resources needed for complex digital signal processing, protocol aggregation, and large-scale control or acceleration tasks, while conforming to industrial temperature and RoHS requirements.

Request a quote or submit a pricing inquiry to evaluate 5SGXMBBR2H43I2G for your next design project.

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