5SGXMBBR2H43I3G

The 5SGXMBBR2H43I3G is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It delivers very high logic density and on-chip memory with extensive I/O, packaged for surface-mount assemblies and specified for industrial temperature operation.

Designed for applications that require a large programmable fabric and significant embedded memory, this device combines 952,000 logic elements with approximately 53.25 Mbits of embedded RAM and up to 600 I/O pins, supporting complex system integration within a single FPGA footprint.

Key Features

• Core Logic  952,000 logic elements provide a high-density programmable fabric for implementing large-scale digital logic and custom accelerators.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffers, state storage, and memory-intensive algorithms without external memory for many use cases.
• I/O Capacity  Up to 600 I/O pins enable broad peripheral and interface connectivity from a single device, simplifying board-level routing for multi-channel designs.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV, enabling defined core-power planning and thermal management in system design.
• Package & Mounting  1760-BBGA (FCBGA) package, supplier device package 1760-HBGA (45×45), optimized for surface-mount assembly in compact, high-density layouts.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, supporting deployment in industrial environments.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free manufacturing processes.

Typical Applications

• High-density signal processing  Implement complex DSP and parallel processing pipelines using the device’s large logic capacity and embedded memory.
• Telecom and networking  Consolidate multiple protocol engines and packet-processing functions leveraging abundant I/O and on-chip RAM.
• Industrial control and automation  Support multi-channel sensor and actuator interfaces with industrial temperature rating and extensive I/O.
• Custom compute accelerators  Create hardware-accelerated functions and offload compute tasks within a single high-density FPGA fabric.

Unique Advantages

• High logic density: 952,000 logic elements allow integration of large designs and multiple functions into one device, reducing board-level component count.
• Large on-chip memory: Approximately 53.25 Mbits of embedded RAM support deep buffering and stateful algorithms without immediate dependence on external memory.
• Extensive I/O: 600 I/Os provide flexibility for multi-channel interfaces, enabling consolidated system architectures and simplified PCB routing.
• Industrial-grade operation: Specified for −40 °C to 100 °C operation, suitable for systems deployed in demanding temperature environments.
• Compact surface-mount package: 1760-BBGA (FCBGA) package offers a high-pin-count solution in a compact 45×45 supplier package footprint for dense system designs.
• Defined core voltage range: 820–880 mV core supply facilitates precise power delivery design and thermal planning for complex FPGA implementations.

Why Choose 5SGXMBBR2H43I3G?

The 5SGXMBBR2H43I3G positions itself as a high-capacity Stratix V GX FPGA for designs that require significant programmable logic, substantial embedded memory, and large I/O counts in an industrial-temperature package. Its combination of 952,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 600 I/Os enables consolidation of multi-functional systems onto a single FPGA, reducing BOM complexity and board space.

This device is well suited to engineering teams building complex signal-processing, networking, industrial control, or custom-acceleration applications who need a proven Stratix V family solution with documented device characteristics and industrial temperature support.

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