5SGXMBBR2H43I3LG

The 5SGXMBBR2H43I3LG is a Stratix V GX field-programmable gate array (FPGA) offering very high logic capacity and on-chip memory for complex, high-density designs. As a GX-class Stratix V device, the series-level electrical characteristics include high-speed transceiver capability and a wide operating envelope.

This device targets applications that require large programmable logic resources, substantial embedded RAM, a high I/O count, and industrial-grade operating range, while supporting low core supply voltages and a 1760-BBGA surface-mount package.

Key Features

• Logic Capacity  952,000 logic elements to support large-scale FPGA designs and complex integration on a single device.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, packet processing, and large datapath storage.
• I/O Density  600 general-purpose I/O pins to simplify board-level routing and enable wide parallel interfaces.
• Transceiver Family Capability  Stratix V GX series transceivers are specified at series-level speeds up to 14.1 Gbps (series capability described in device documentation).
• Power and Core Voltage  Core supply range of 820 mV to 880 mV to match low-voltage system designs.
• Package and Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45) with surface-mount mounting for compact, high‑density PCB designs.
• Temperature Grade  Industrial grade with operating temperature range from −40 °C to 100 °C for extended environmental tolerance.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-speed serial communications  Leverage the Stratix V GX series transceiver capability to implement high-speed link interfaces and protocol bridging.
• Compute- and memory-intensive processing  Large logic capacity and approximately 53.25 Mbits of embedded RAM enable complex packet processing, DSP, and acceleration tasks.
• Industrial systems  Industrial temperature grading (−40 °C to 100 °C) and a robust package make the device suitable for demanding ambient conditions.
• High-density I/O applications  600 I/O pins support wide parallel interfaces, multi-channel sensor and data acquisition front ends, and large bus fabrics.

Unique Advantages

• Extensive on-chip logic: 952,000 logic elements reduce the need for multiple devices and simplify system architecture for large designs.
• Significant embedded memory: Approximately 53.25 Mbits of RAM supports large buffers, FIFOs, and on-chip data staging without external memory in many designs.
• High I/O count: 600 I/O pins enable broad peripheral connectivity and high channel counts with fewer external components.
• Industrial operating range: Rated from −40 °C to 100 °C to accommodate extended-temperature deployments.
• Low core-voltage operation: 820–880 mV supply range aligns with low-voltage system architectures and power-optimized designs.
• Industry-standard packaging: 1760-BBGA (FCBGA) footprint and surface-mount mounting facilitate compact PCB layouts and manufacturing.

Why Choose 5SGXMBBR2H43I3LG?

The 5SGXMBBR2H43I3LG delivers a combination of very high logic capacity, substantial embedded memory, and broad I/O density in an industrial‑grade Stratix V GX device. Its electrical characteristics and series-level transceiver capabilities make it suitable for designs that require high integration, significant on-chip resources, and extended temperature operation.

Engineers and procurement teams looking to consolidate functions, reduce board-level complexity, and support demanding environmental requirements will find this device appropriate for high-density processing, communications interfaces, and industrial applications where a robust FPGA platform is required.

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