5SGXMBBR3H43C2LG

The 5SGXMBBR3H43C2LG is a Stratix V GX FPGA IC in a 1760-BBGA (FCBGA) package from Intel. It delivers very large programmable logic capacity and on-chip memory combined with a high I/O count, making it suitable for complex digital designs that require substantial integration in a single device.

This commercial-grade device is specified for a core supply voltage range of 820 mV to 880 mV and an operating temperature range of 0°C to 85°C. The device datasheet provides comprehensive electrical and switching characteristics, including I/O timing and transceiver information for the Stratix V family.

Key Features

• Logic Capacity — 952,000 logic elements and 359,200 logic blocks provide a very large fabric for implementing complex logic, control, and datapath functions.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM available for FIFOs, buffers, and memory-mapped structures to support high-capacity designs.
• I/O Density — 600 user I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
• Package and Mounting — 1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting suitable for standard PCB assembly.
• Power — Core supply voltage range specified from 820 mV to 880 mV to match system power budgeting.
• Temperature Grade — Commercial grade with an operating range of 0°C to 85°C for general-purpose applications.
• Compliance — RoHS compliant.

Typical Applications

• High-density logic systems — Use the large pool of logic elements and logic blocks to implement extensive control, signal processing, and custom compute functions in a single device.
• Memory-intensive designs — Leverage approximately 53.25 Mbits of embedded RAM for buffering, packet processing, or large local data structures.
• Parallel interface platforms — The 600 I/O pins support wide buses, multiple peripherals, and high-pin-count interfaces for system integration.
• Complex SoC integration — Combine substantial logic fabric and memory resources to integrate custom accelerators, controllers, and glue logic within a compact package footprint.

Unique Advantages

• Large on-chip resources: 952,000 logic elements and approximately 53.25 Mbits of embedded memory enable consolidation of large designs and reduce external memory dependence.
• High I/O count: 600 I/O pins allow flexible routing of parallel interfaces and extensive peripheral connectivity without additional multiplexing hardware.
• Compact, high-pin package: 1760-BBGA (FCBGA) / 1760-HBGA (45×45) packaging provides a dense pinout in a controlled footprint for space-constrained boards.
• Commercial-grade specification: Rated for 0°C to 85°C operation and RoHS compliance to meet general commercial product requirements.
• Surface-mount compatibility: Surface-mount package supports standard PCB assembly practices for volume production.

Why Choose 5SGXMBBR3H43C2LG?

The 5SGXMBBR3H43C2LG provides a high-capacity Stratix V GX implementation for designs that require extensive programmable logic, substantial embedded RAM, and a large number of I/Os in a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of general-purpose commercial systems.

This device is appropriate for engineering teams and system designers looking to consolidate complex logic and memory-heavy functions into a single FPGA while maintaining a compact board footprint and standard surface-mount assembly.

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