5SGXMBBR3H43C3N

The 5SGXMBBR3H43C3N is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1760‑BBGA (FCBGA) package. It provides a high-density programmable fabric with approximately 952,000 logic elements and roughly 53.25 Mbits of embedded memory, paired with 600 user I/O pins for broad system integration.

Specified for surface-mount assembly and offered in a commercial temperature grade (0 °C to 85 °C), this device targets complex programmable-logic designs that require large logic capacity, significant on-chip RAM, and dense I/O in a compact BGA footprint.

Key Features

• Logic Capacity  Approximately 952,000 logic elements to implement large-scale, high-density digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O Density  600 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting  1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45). Surface-mount mounting type for modern board assembly flows.
• Power  Core supply voltage range specified at 820 mV to 880 mV, enabling proper core power planning for system design.
• Temperature & Grade  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, meeting common environmental/lead-free requirements for assembly.

Unique Advantages

• High integration density: Large logic element count and substantial on-chip RAM reduce the need for external logic and memory, simplifying system BOM.
• Broad I/O capability: 600 I/Os give flexibility for parallel buses, multi‑lane interfaces, and mixed-signal front-ends without immediate pin limitations.
• Compact BGA footprint: 1760‑BBGA package offers a dense package option that supports complex routing in space-constrained designs.
• Commercial temperature rating: Clear 0 °C to 85 °C operating range aligns the device to mainstream commercial applications and environments.
• Defined core voltage window: 820 mV–880 mV specification enables precise power-supply planning and thermal management for the FPGA core.
• RoHS compliant: Conforms to environmental lead-free requirements for modern electronic products.

Why Choose 5SGXMBBR3H43C3N?

The 5SGXMBBR3H43C3N combines very large logic capacity, significant on-chip memory, and high I/O density in a single Stratix V GX FPGA package. These concrete specifications make it a suitable choice when a design demands substantial programmable logic, embedded RAM, and flexible external connectivity while maintaining a commercial temperature profile.

With a defined core voltage range and a compact 1760‑BBGA surface-mount package, this device supports engineered power and board-level choices for designers focused on scalable, high-density FPGA implementations.

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