5SGXMBBR3H43I3LG

The 5SGXMBBR3H43I3LG is a Stratix® V GX family FPGA IC offering very high logic density and substantial on-chip memory in an industrial-grade, surface-mount FCBGA package. Built for complex system designs, it delivers 952,000 logic elements, approximately 53 Mbits of embedded memory, and up to 600 user I/Os to support demanding processing, control, and interface tasks.

This device is supplied in a 1760-ball BBGA (1760-HBGA, 45×45) package and is specified for industrial temperature operation. The accompanying Stratix V device documentation provides detailed electrical and switching characteristics, including I/O timing and transceiver specification guidance for system integration.

Key Features

• Core density 952,000 logic elements to implement large-scale combinational and sequential logic, state machines, and control structures.
• Embedded memory Approximately 53 Mbits of on-chip RAM for buffering, frame storage, and memory-intensive algorithms.
• I/O capability Up to 600 user I/Os to support wide parallel interfaces, multi-channel connectivity, and complex board-level routing.
• Package & mounting 1760-BBGA FCBGA package (supplier device package: 1760-HBGA, 45×45) with surface-mount mounting suitable for high-pin-count board designs.
• Power Core supply voltage range: 820 mV to 880 mV, enabling integration into low-voltage power domains.
• Industrial temperature grade Rated for operation from −40 °C to 100 °C for robust performance in temperature-challenging environments.
• Standards & compliance RoHS compliant.
• Comprehensive device documentation Stratix V device datasheet includes electrical and switching characteristics, I/O timing, and transceiver-level information to aid validation and deployment.

Typical Applications

• Industrial automation and control High logic capacity and industrial temperature rating make the device suitable for complex control systems, motion control, and deterministic I/O handling.
• Data and signal processing Large on-chip memory and extensive logic resources support real-time signal processing, filtering, and streaming data pipelines.
• Communications and network infrastructure Abundant I/O and family-level transceiver documentation enable implementation of multi-channel interfaces and protocol bridging.
• Prototyping and system integration High-density fabric and broad I/O enable rapid prototyping of large digital subsystems and integration of multiple IP blocks on a single device.

Unique Advantages

• High logic capacity: 952,000 logic elements provide the headroom to implement complex finite-state machines, pipelines, and parallel processing architectures without partitioning across multiple devices.
• Substantial embedded memory: Approximately 53 Mbits of on-chip RAM reduce external memory dependence and simplify board-level memory architectures.
• Extensive I/O connectivity: 600 user I/Os accommodate broad connectivity needs for sensors, buses, and wide data paths, minimizing external multiplexing.
• Industrial reliability: Specified −40 °C to 100 °C operating range and industrial grade designation support deployments in temperature-variable environments.
• Compact high-pin-count package: 1760-BBGA (1760-HBGA, 45×45) offers a compact footprint for high-density PCB layouts while preserving a large I/O count.
• Low-voltage core operation: 820–880 mV core supply accommodates low-voltage power domains and can be leveraged in power-sensitive system designs.

Why Choose 5SGXMBBR3H43I3LG?

The 5SGXMBBR3H43I3LG positions itself for designs that demand very high logic density, significant embedded RAM, and broad I/O in an industrial-rated FPGA. Its combination of 952,000 logic elements, approximately 53 Mbits of on-chip memory, and 600 I/Os enables integration of large digital subsystems, complex processing pipelines, and multi-interface controllers within a single device footprint.

Engineers targeting industrial automation, high-throughput signal processing, advanced prototyping, or communication infrastructure will find the device’s electrical characterization and Stratix V family documentation useful for system validation and deployment, while the FCBGA package supports compact, high-pin-count PCB designs.

Request a quote or submit a purchase inquiry to evaluate the 5SGXMBBR3H43I3LG for your next high-density FPGA design. Technical documentation for the Stratix V family is available to assist with integration and system-level planning.