5SGXMBBR3H43I3LN

The 5SGXMBBR3H43I3LN is a Stratix V GX family FPGA from Intel presented in a 1760‑BBGA FCBGA package. It delivers high logic density and on-chip embedded memory suitable for complex, programmable digital designs in industrial environments.

As a member of the Stratix V GX series, the device is offered in industrial grades and supports series-level transceiver speed grades. The part combines large logic capacity, extensive I/O, and packaged integration for surface-mount board designs.

Key Features

• Core Logic  Approximately 952,000 logic elements for large-scale programmable logic integration.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM (53,248,000 total RAM bits) for buffering, packet memory, and intermediate storage.
• I/O Density  600 user I/Os to support dense external connectivity and multi-channel interfaces.
• Package & Mounting  1760‑BBGA, FCBGA package (supplier device package: 1760‑HBGA, 45 × 45 mm) in a surface-mount form factor for compact board-level integration.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV (0.820–0.880 V).
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Standards  RoHS compliant for environmental and manufacturing compatibility.
• Series-Level Transceiver Capability  Stratix V GX series transceiver speed grades are documented in the series datasheet (series-level GX channel capability includes up to 14.1 Gbps).

Typical Applications

• High-density signal processing  Large logic capacity and substantial on-chip RAM make this FPGA suitable for complex data-path and DSP-centric implementations.
• High-throughput communications  Stratix V GX series transceiver performance supports high-speed serial links at series-level GX channel rates noted in the datasheet.
• Industrial control and automation  Industrial temperature grade (−40 °C to 100 °C) and robust I/O count support demanding industrial system designs.

Unique Advantages

• High logic integration: With approximately 952,000 logic elements, the device enables consolidation of multiple functions into a single FPGA, reducing component count.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory provides headroom for buffering, packet processing, and intermediate storage without external memory.
• Extensive I/O connectivity: 600 I/Os allow direct connection to numerous peripherals, high-speed interfaces, and multi-lane systems.
• Industrial operating range: Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
• Compact, surface-mount package: The 1760‑BBGA (1760‑HBGA supplier package, 45 × 45 mm) supports high-density PCB layouts and automated assembly.
• Controlled core supply envelope: Core supply specified at 0.820–0.880 V, enabling predictable power provisioning for system design.

Why Choose 5SGXMBBR3H43I3LN?

The 5SGXMBBR3H43I3LN combines large-scale programmable logic, tens of megabits of embedded RAM, and hundreds of I/Os in a single industrial-grade Stratix V GX FPGA package. Its specifications make it well suited for designs that require dense logic integration, significant on-chip memory, and robust I/O connectivity within a surface-mount board footprint.

Engineers and procurement teams seeking a high-density, industrial-grade FPGA solution will find this Stratix V GX device appropriate for complex digital systems where series-level transceiver capability and packaged integration are necessary. The device’s documented operating and electrical parameters allow for deterministic system-level power and thermal planning.

Request a quote or submit a product inquiry to obtain pricing, availability, and lead-time information for the 5SGXMBBR3H43I3LN.