A3P030-1QNG48

The A3P030-1QNG48 is a ProASIC3 Flash-based FPGA from Microchip Technology presented in a 48-VFQFN exposed pad package. It delivers 768 logic elements (approximately 30,000 gates) with 34 programmable I/O pins, targeted for compact, surface-mount designs.

With a specified core supply range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C, this device suits applications that require moderate logic density in a small, RoHS-compliant package footprint.

Key Features

• Logic Density 768 logic elements providing approximately 30,000 gates for implementing custom combinational and sequential logic.
• I/O 34 general-purpose I/O pins for interfacing to peripherals, sensors, and external logic.
• Package 48-VFQFN exposed pad (supplier package: 48-QFN 6×6) for compact board-level integration and thermal path via exposed pad.
• Power Core voltage supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Mounting Surface-mount device suitable for automated PCB assembly.
• Temperature Range Commercial operating range of 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• Custom Logic and Glue Functions Designs that require up to 768 logic elements and 34 I/O to implement glue logic, protocol adaptation, or control sequencing in a compact package.
• Compact Embedded Systems Small-form-factor embedded boards where a 48-VFQFN exposed pad package and surface-mount assembly are preferred.
• Prototype and Low- to Medium-Density FPGA Designs Projects that need programmable logic capacity of approximately 30,000 gates with a defined commercial temperature range.

Unique Advantages

• Compact package with exposed pad — 48-VFQFN (6×6) offers a small PCB footprint with an exposed pad for enhanced board-level thermal conduction.
• Clear logic capacity — 768 logic elements and ~30,000 gates give predictable implementation capacity for moderate complexity designs.
• Defined I/O count — 34 I/O pins simplify interface planning for peripheral and signal routing requirements.
• Controlled power envelope — Narrow core supply range (1.425 V–1.575 V) allows straightforward power-supply selection and regulation design.
• RoHS compliant — Meets environmental restrictions for lead-free assembly processes.
• Surface-mount ready — Suited for automated assembly processes and compact system designs.

Why Choose A3P030-1QNG48?

The A3P030-1QNG48 positions itself as a compact, Flash-based ProASIC3 FPGA option for designers needing predictable logic capacity, a moderate number of I/O, and a small QFN footprint. Its defined supply-voltage window and commercial temperature rating make it appropriate for a range of consumer and industrial-adjacent embedded applications where board space and deterministic logic resources are important.

Backed by Microchip Technology support and provided in a RoHS-compliant, surface-mount 48-VFQFN exposed pad package, this device offers a balance of integration and practical system-level considerations for teams implementing moderate-density programmable logic today.

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