5SGXMBBR3H43I4N

The 5SGXMBBR3H43I4N is a Stratix V GX field programmable gate array (FPGA) packaged in a 1760-BBGA FCBGA surface-mount case. It provides very high logic density and on-chip memory, combined with a large I/O count and industrial temperature support for demanding embedded and system-level designs.

With 952,000 logic elements and approximately 53 Mbits of embedded memory, this device is suited for designs that require extensive programmable logic, large on-chip buffering, and dense I/O integration while operating across an industrial temperature range.

Key Features

• High-density logic  952,000 logic elements for complex, large-scale programmable logic implementation.
• On-chip memory  Approximately 53 Mbits of embedded RAM to support large buffering, packet processing, or data-path storage.
• Large I/O count  600 available I/O pins to enable extensive external connectivity and multi-channel system integration.
• Industrial operating range  Rated for operation from -40 °C to 100 °C, suitable for applications requiring industrial-grade temperature tolerance.
• Low-voltage core operation  Core voltage supply specified between 820 mV and 880 mV for the device core domain.
• Packaging & mounting  1760-BBGA (FCBGA) surface-mount package; supplier device package listed as 1760-HBGA (45×45).
• Series-level transceiver options  As a Stratix V GX device, the series offers multiple transceiver speed grades (series-level information includes channels at 14.1 Gbps, 12.5 Gbps, and 8.5 Gbps depending on speed grade).
• RoHS compliant  Device is RoHS compliant.

Typical Applications

• High-density logic implementations  Use where large amounts of programmable logic are required for custom hardware acceleration or complex FPGA partitioning.
• Large on-chip buffering and memory-intensive functions  Embedded RAM supports designs that need substantial on-chip data storage for streaming, buffering, or packet processing.
• Multi-channel I/O systems  High I/O count facilitates integration with many peripherals, interfaces, or parallel data lanes.
• Industrial embedded systems  Industrial temperature rating supports deployment in environments requiring extended operating temperature ranges.

Unique Advantages

• Extensive logic capacity: 952,000 logic elements reduce the need for multi-device solutions and simplify board-level partitioning.
• Significant embedded memory: Approximately 53 Mbits of on-chip RAM enables large buffers and minimizes external memory dependency.
• High I/O integration: 600 I/Os allow complex system interfaces and dense peripheral connectivity without additional bridging components.
• Industrial temperature support: -40 °C to 100 °C rating helps ensure reliable operation in harsher environments.
• Compact surface-mount package: 1760-BBGA FCBGA packaging provides high pin-count in a compact footprint for space-constrained designs.
• Series-level transceiver flexibility: Stratix V GX series offers multiple transceiver speed grades to match channel performance requirements at the series level.

Why Choose 5SGXMBBR3H43I4N?

The 5SGXMBBR3H43I4N positions itself as a high-density, industrial-temperature FPGA option for engineers who need large programmable logic resources, substantial on-chip memory, and broad I/O connectivity in a single device. Its combination of 952,000 logic elements, approximately 53 Mbits of embedded RAM, and 600 I/Os supports complex designs that benefit from integration and reduced board-level complexity.

This device is suited to teams building systems that require scalable programmable logic with industrial operating range and compact BGA packaging. The series-level transceiver options and RoHS compliance add to its suitability for demanding, production-grade FPGA deployments.

Request a quote or submit an inquiry for pricing and availability to begin evaluating the 5SGXMBBR3H43I4N for your design.