5SGXMBBR3H43C2N

The 5SGXMBBR3H43C2N is a high-density Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1760-BBGA FCBGA package. It provides a large pool of programmable logic, substantial on‑chip memory, and a high I/O count for designs that require significant integration and interface capacity.

Targeted at commercial-grade systems, this device is suited for applications that benefit from dense logic resources, abundant embedded RAM, and extensive I/O connectivity while operating within a 0 °C to 85 °C range and a core supply window of 870 mV to 930 mV.

Key Features

• High Logic Capacity — 952,000 logic elements to support complex digital designs and large-scale programmable logic implementations.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM available for buffering, state storage, and data processing tasks.
• Extensive I/O — 600 user I/O pins to accommodate high‑port-count interfaces, multiple peripherals, and broad signal routing.
• Power and Voltage — Core voltage supply range of 870 mV to 930 mV to match platform power requirements.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
• Package and Mounting — 1760-BBGA (FCBGA) package; supplier package listed as 1760-HBGA (45×45). Surface-mount mounting type for board-level integration.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High-density digital processing — Use the large logic element count and substantial on-chip memory for complex signal processing and algorithm acceleration.
• Interface aggregation and protocol bridging — Leverage 600 I/Os to consolidate multiple external interfaces and implement protocol translation or aggregation logic.
• Custom hardware prototypes — Rapidly prototype SoC functions and verify large-scale digital designs using the device’s extensive programmable resources.

Unique Advantages

• Massive programmable logic: 952,000 logic elements provide headroom for expansive logic synthesis and multi-function designs.
• Significant embedded memory: Approximately 53 Mbits of on-chip RAM reduces external memory dependence and improves data locality.
• High I/O count: 600 I/Os simplify designs that require many external signals or dense connector interfaces.
• Compact, high-density package: 1760-BBGA (1760-HBGA supplier package, 45×45) enables dense board integration while keeping a high pin count.
• Commercial operating range: Rated for 0 °C to 85 °C to match standard commercial deployments.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5SGXMBBR3H43C2N?

The 5SGXMBBR3H43C2N balances exceptional logic density, plentiful embedded memory, and a high I/O count in a single commercial‑grade FPGA package. Its electrical and packaging characteristics make it appropriate for designs that demand large programmable resources and extensive external connectivity within a standard commercial temperature envelope.

Choose this Stratix V GX device when your project needs scalable logic capacity, significant on‑chip RAM, and numerous I/Os to consolidate functionality and reduce external components while maintaining RoHS compliance and surface-mount board assembly.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the 5SGXMBBR3H43C2N.