5SGXMBBR3H43C2G

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA

Quantity 933 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMBBR3H43C2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA

The 5SGXMBBR3H43C2G is a Stratix® V GX field programmable gate array offering high on-chip capacity and extensive I/O in a compact FCBGA package. It provides 952,000 logic elements and approximately 53.248 Mbits of embedded memory to support complex digital designs that require large programmable fabric and substantial on-chip RAM.

Designed as a commercial-grade device with surface-mount packaging, this Stratix V GX FPGA targets high-density applications that require a large number of I/O pins and a low-voltage core operating window.

Key Features

  • Programmable Logic  952,000 logic elements provide a large fabric capacity for complex logic integration and system consolidation.
  • Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support buffering, large-scale state machines, and data-path storage.
  • I/O Density  600 user I/O pins to enable extensive peripheral interfacing and high-pin-count system integration.
  • Package and Mounting  1760-BBGA (FCBGA) package, supplier device package 1760-HBGA (45×45), optimized for surface-mount PCB assembly.
  • Power and Core Voltage  Core supply operating range from 870 mV to 930 mV, enabling defined low-voltage system designs.
  • Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Standards Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High integration density: The combination of 952,000 logic elements and ~53.248 Mbits of embedded RAM reduces the need for external logic and memory, simplifying board-level design.
  • Extensive I/O capability: 600 I/O pins enable broad connectivity for multi-interface systems and high-channel-count front-ends.
  • Compact FCBGA packaging: 1760-BBGA (1760-HBGA supplier footprint) enables compact PCB layouts while supporting large FPGA capacity.
  • Low-voltage core support: Core voltage window (870–930 mV) supports designs targeting modern low-voltage power domains.
  • Commercial temperature rating: Operates across a 0 °C to 85 °C range suitable for commercial-grade applications and environments.
  • RoHS compliant: Facilitates compliance with common environmental manufacturing standards.

Why Choose 5SGXMBBR3H43C2G?

The 5SGXMBBR3H43C2G Stratix V GX FPGA combines very large programmable logic capacity with substantial on-chip RAM and a high pin-count I/O interface in a space-efficient 1760-BBGA package. Its defined core voltage range and commercial operating temperature make it suitable for high-density, board-level systems where integration and on-chip resources are priorities.

This device is well suited for design teams seeking a robust, high-capacity FPGA fabric that consolidates logic and memory on-chip while maintaining extensive external connectivity and a compact package footprint.

Request a quote or submit a sales inquiry to receive pricing, availability, and lead-time information for the 5SGXMBBR3H43C2G.

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