5SGXMBBR3H43C2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 933 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMBBR3H43C2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA
The 5SGXMBBR3H43C2G is a Stratix® V GX field programmable gate array offering high on-chip capacity and extensive I/O in a compact FCBGA package. It provides 952,000 logic elements and approximately 53.248 Mbits of embedded memory to support complex digital designs that require large programmable fabric and substantial on-chip RAM.
Designed as a commercial-grade device with surface-mount packaging, this Stratix V GX FPGA targets high-density applications that require a large number of I/O pins and a low-voltage core operating window.
Key Features
- Programmable Logic 952,000 logic elements provide a large fabric capacity for complex logic integration and system consolidation.
- Embedded Memory Approximately 53.248 Mbits of on-chip RAM to support buffering, large-scale state machines, and data-path storage.
- I/O Density 600 user I/O pins to enable extensive peripheral interfacing and high-pin-count system integration.
- Package and Mounting 1760-BBGA (FCBGA) package, supplier device package 1760-HBGA (45×45), optimized for surface-mount PCB assembly.
- Power and Core Voltage Core supply operating range from 870 mV to 930 mV, enabling defined low-voltage system designs.
- Temperature and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Standards Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Unique Advantages
- High integration density: The combination of 952,000 logic elements and ~53.248 Mbits of embedded RAM reduces the need for external logic and memory, simplifying board-level design.
- Extensive I/O capability: 600 I/O pins enable broad connectivity for multi-interface systems and high-channel-count front-ends.
- Compact FCBGA packaging: 1760-BBGA (1760-HBGA supplier footprint) enables compact PCB layouts while supporting large FPGA capacity.
- Low-voltage core support: Core voltage window (870–930 mV) supports designs targeting modern low-voltage power domains.
- Commercial temperature rating: Operates across a 0 °C to 85 °C range suitable for commercial-grade applications and environments.
- RoHS compliant: Facilitates compliance with common environmental manufacturing standards.
Why Choose 5SGXMBBR3H43C2G?
The 5SGXMBBR3H43C2G Stratix V GX FPGA combines very large programmable logic capacity with substantial on-chip RAM and a high pin-count I/O interface in a space-efficient 1760-BBGA package. Its defined core voltage range and commercial operating temperature make it suitable for high-density, board-level systems where integration and on-chip resources are priorities.
This device is well suited for design teams seeking a robust, high-capacity FPGA fabric that consolidates logic and memory on-chip while maintaining extensive external connectivity and a compact package footprint.
Request a quote or submit a sales inquiry to receive pricing, availability, and lead-time information for the 5SGXMBBR3H43C2G.

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