5SGXMBBR2H43I3LN

The 5SGXMBBR2H43I3LN is a Stratix® V GX field programmable gate array (FPGA) in a 1760‑BBGA FCBGA package. It provides high logic density and substantial on‑chip memory for complex, programmable digital designs, with a wide I/O count and industrial temperature grading for deployment in temperature‑sensitive systems.

As a member of the Stratix V GX family, this device targets designs that require a large number of logic elements, extensive embedded RAM, and robust I/O capability within a surface‑mount, high‑pin‑count package.

Key Features

• Core Logic  952,000 logic elements provide significant programmable fabric for complex FPGA implementations.
• Logic Array Blocks (CLBs)  359,200 CLBs for structured logic partitioning and design scalability.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support data buffering, FIFOs, and memory‑rich algorithms.
• I/O Capacity  600 user I/O pins to accommodate wide parallel interfaces and extensive peripheral connectivity.
• Power Supply  Core voltage range of 820 mV to 880 mV for defined operating conditions.
• Package & Mounting  1760‑BBGA (FCBGA) package, supplier device package 1760‑HBGA (45×45), designed for surface‑mount PCB assembly.
• Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature‑variable environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑density digital systems  Use the large logic element count and CLB resources for complex custom logic, datapath acceleration, and algorithm implementation.
• Memory‑intensive designs  Deploy the on‑chip RAM for buffering, packet processing, or intermediate data storage within FPGA‑centric systems.
• High‑pin I/O systems  Support wide parallel interfaces, multiple peripherals, and board‑level interconnects with 600 I/O pins.
• Industrial applications  Suitable for systems requiring industrial temperature operation (−40 °C to 100 °C) and surface‑mount packaging.

Unique Advantages

• High logic capacity: 952k logic elements enable large, complex designs without immediate need for multi‑device partitioning.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O complement: 600 I/O pins give flexibility to connect multiple high‑pin peripherals or wide data buses directly to the FPGA.
• Industrial temperature rating: Rated from −40 °C to 100 °C for reliable operation across a broad temperature range.
• High‑pin FCBGA packaging: 1760‑BBGA/1760‑HBGA package supports high‑density board layouts and surface‑mount assembly.
• Standards‑oriented family support: As a Stratix V GX device, it aligns with the device family’s documented electrical characteristics and operating conditions.

Why Choose 5SGXMBBR2H43I3LN?

The 5SGXMBBR2H43I3LN combines a very large programmable fabric, extensive embedded RAM, and a high I/O count in a single industrial‑grade FCBGA package. These characteristics make it well suited to designs that require dense logic, substantial on‑chip memory, and broad board connectivity while operating across a wide temperature range.

This device is targeted at engineering teams and system designers who need scalable FPGA resources and deterministic electrical characteristics from the Stratix V GX family for demanding digital processing and I/O‑heavy applications.

If you would like pricing, availability, or to request a quote for the 5SGXMBBR2H43I3LN, please submit a quote request or contact sales to begin the procurement process.