5SGXMBBR2H43C2G

The 5SGXMBBR2H43C2G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) optimized for high-density programmable logic and large on-chip memory requirements. The device integrates 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 600 I/O pins in a surface-mount 1760-BBGA (FCBGA) package.

Engineered for commercial-grade applications, the device operates from a core supply range of 870 mV to 930 mV and across a 0 °C to 85 °C operating temperature range, delivering a platform for complex, memory‑intensive and high‑I/O designs.

Key Features

• Core Logic Capacity  952,000 logic elements to implement large-scale programmable logic functions and complex custom architectures.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms.
• High I/O Density  600 I/O pins for broad peripheral interfacing and high-pin-count board integration.
• Package & Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45); surface-mount for compact board designs.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power-rail constraints.
• Temperature & Grade  Commercial grade device with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• High-density programmable compute  Use the large logic capacity and embedded memory for custom accelerators, signal processing, and complex algorithm implementation.
• Protocol and packet processing  Leverage on-chip RAM and logic to implement packet buffering, parsing, and protocol bridges.
• I/O-rich system integration  Support multi‑lane, multi‑interface designs that require extensive pin counts and flexible I/O routing.

Unique Advantages

• Massive logic resources: 952,000 logic elements enable dense, feature-rich designs without immediate migration to larger device families.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces external memory dependence and simplifies board-level memory architecture.
• Extensive I/O capability: 600 I/Os provide the flexibility to connect multiple interfaces, peripherals, and high-pin-count subsystems.
• Compact, surface-mount packaging: 1760-BBGA (FCBGA) footprint supports high-density PCB layouts and automated assembly.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to match mainstream industrial and commercial system requirements.
• Regulatory-ready: RoHS compliance facilitates integration into lead‑free manufacturing processes.

Why Choose 5SGXMBBR2H43C2G?

The 5SGXMBBR2H43C2G positions itself as a high-capacity Stratix® V GX FPGA solution for designers who need deep logic resources, significant on-chip memory, and a high I/O count in a compact surface-mount package. Its core voltage window and commercial temperature rating make it suitable for a wide range of performance-focused, memory‑intensive applications.

This device is appropriate for engineering teams building complex programmable logic systems that require integration density, robust on-chip RAM, and extensive connectivity while maintaining compliance with RoHS directives.

Request a quote or submit your design requirements to receive pricing and availability information for the 5SGXMBBR2H43C2G.