5SGXMBBR2H40I2N

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA

Quantity 646 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMBBR2H40I2N – Stratix® V GX Field Programmable Gate Array, 1517-BBGA (FCBGA)

The 5SGXMBBR2H40I2N is a Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package intended for industrial-grade designs. It combines a large logic fabric with substantial embedded memory and extensive I/O to address high-density, high-bandwidth FPGA applications.

With 952,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 696 I/O pins, this device targets designs that require heavy logic integration, significant on-chip storage, and broad external interfacing. As a member of the Stratix V GX family, it aligns with the series' high-speed transceiver capabilities and industrial temperature grading.

Key Features

  • Logic Capacity  952,000 logic elements (cells) to implement complex digital designs and deep custom logic.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for large buffering, LUT-based storage, and local data structures.
  • High-Density I/O  696 programmable I/O pins to support wide parallel interfaces, multi-channel connectivity, and diverse external peripherals.
  • Transceiver-Class Device Family  Part of the Stratix V GX family, which includes high-speed transceiver capability as described in the series documentation.
  • Package  1517-BBGA (FCBGA) footprint; supplier package listed as 1517-HBGA (45×45) for system packaging considerations.
  • Power Supply  Core voltage specified between 870 mV and 930 mV for defined power-rail planning.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for robust performance in demanding environments.
  • Mounting  Surface-mount package suitable for modern PCB assembly processes.
  • RoHS Compliant  Manufactured in compliance with RoHS environmental standards.

Typical Applications

  • High-density FPGA compute  Large-scale custom logic and hardware-accelerated processing where hundreds of thousands of logic elements and abundant embedded RAM are required.
  • High-bandwidth I/O and interfacing  Systems that need wide parallel or multi-channel external connectivity using the device's 696 I/O pins.
  • Network and communications modules  Designs leveraging the Stratix V GX family’s transceiver-class capabilities for high-speed serial links alongside extensive on-chip logic and memory.
  • Industrial controls and instrumentation  Applications that benefit from the device’s industrial temperature range and high integration to consolidate multiple functions into a single FPGA.

Unique Advantages

  • Massive logic resources: 952,000 logic elements provide headroom for large designs and complex state machines without immediate need for multiple devices.
  • Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory and simplifies data-path design.
  • Extensive external interfacing: 696 I/Os enable broad parallel interfaces and flexible board-level connectivity options.
  • Industrial operation: –40 °C to 100 °C rating supports deployment in harsher environments and industrial systems.
  • Compact, production-ready package: 1517-BBGA (FCBGA) surface-mount package balances density with assembly compatibility for system integration.
  • Defined supply rail: Core voltage range of 870 mV–930 mV provides a clear power specification for system power delivery design.

Why Choose 5SGXMBBR2H40I2N?

The 5SGXMBBR2H40I2N positions itself where large FPGA capacity, substantial embedded memory, and broad I/O converge with industrial-grade operation. Its combination of 952,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 696 I/O makes it suitable for high-density designs that require integration of compute, buffering, and numerous external interfaces in a single device.

Engineers and procurement teams targeting scalable, reliable designs will find this Stratix V GX device appropriate for complex processing, connectivity-rich modules, and industrial applications that demand defined power rails and extended temperature support. The device benefits from the Stratix V family documentation and specifications for system-level planning and integration.

Request a quote or submit an inquiry to evaluate 5SGXMBBR2H40I2N for your next design project and to obtain pricing and availability details.

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