5SGXMBBR2H43C2LG

The 5SGXMBBR2H43C2LG is a Stratix® V GX field programmable gate array (FPGA) optimized for designs that require very high logic capacity, substantial on-chip memory, and a large I/O count. This commercial-grade, surface-mount device delivers 952,000 logic elements and approximately 53.248 Mbits of embedded memory to support complex, memory‑intensive programmable logic implementations.

Packaged in a 1760‑BBGA (FCBGA) format with a supplier device package of 1760‑HBGA (45×45), the device supports up to 600 I/O pins and operates over a commercial temperature range. The part leverages the Stratix V GX family architecture and associated documentation for high-density, high-integration system designs.

Key Features

• Core and Logic  952,000 logic elements provide extensive programmable logic resources for large-scale FPGA designs.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support buffering, packet processing, and data‑intensive functions.
• I/O Capacity  Up to 600 I/O pins enable high‑port-count interfaces and dense board-level integration.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV to match system power-architecture requirements.
• Package and Mounting  1760‑BBGA (FCBGA) package; supplier device package 1760‑HBGA (45×45). Surface-mount mounting type facilitates standard PCB assembly flows.
• Temperature and Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Series Documentation  Part of the Stratix V GX family; the series datasheet documents available core and transceiver speed grades and electrical characteristics for design planning.

Typical Applications

• High-density FPGA systems  Use the large logic capacity and embedded memory for complex, highly-parallel programmable logic implementations.
• Data buffering and packet processing  Approximately 53 Mbits of on-chip RAM supports deep buffering and data-path acceleration tasks.
• High I/O interface boards  600 I/O pins enable multi-channel connectivity and dense peripheral interfacing on a single device.
• Prototype and system integration  Surface-mount 1760‑BBGA package supports modern PCB layouts and high-density system prototypes.

Unique Advantages

• Substantial logic capacity: 952,000 logic elements provide the headroom required for large-scale integration and multi-function designs.
• Significant on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces reliance on external memory for many data-centric functions.
• High I/O count: 600 I/O pins simplify board-level routing for multi-channel and high-port-count applications.
• Industry-standard packaging: 1760‑BBGA/1760‑HBGA (45×45) package supports established assembly processes and dense PCB designs.
• Commercial-grade operating range: Rated 0 °C to 85 °C for designs targeting commercial temperature environments.
• RoHS compliant: Meets environmental compliance requirements for lead‑free manufacturing.

Why Choose 5SGXMBBR2H43C2LG?

The 5SGXMBBR2H43C2LG combines very large logic capacity, substantial embedded memory, and a high I/O count in a single, surface-mount Stratix V GX package. It is suited to designers and teams building complex programmable systems that need integrated memory and extensive I/O without splitting functions across multiple devices.

As a member of the Intel Stratix V GX family, this part benefits from the family-level documentation and electrical characteristics provided in the series datasheet, enabling informed system-level planning and scalability within the Stratix V product line.

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