5SGXMBBR2H40I2LN

The 5SGXMBBR2H40I2LN is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It provides a high-density programmable fabric with a large on-chip memory footprint and a very high I/O count for complex digital designs.

Engineered for industrial temperature operation, this device targets systems that require abundant logic capacity, significant embedded RAM, and extensive I/O connectivity while operating from a low-voltage core supply.

Key Features

• High-density programmable fabric — 952,000 logic elements to implement large-scale digital designs and custom processing pipelines.
• Embedded memory — Approximately 53.2 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
• Extensive I/O — 696 I/O pins to support a wide range of interfaces and board-level connectivity.
• Core supply — Operates from a core voltage range of 820 mV to 880 mV for specified device operating conditions.
• Industrial temperature grade — Rated for -40 °C to 100 °C to meet demanding environmental requirements.
• Package and mounting — 1517-BBGA, FCBGA package; supplier device package specified as 1517-HBGA (45×45). Surface-mount mounting type.
• Regulatory compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implement large combinational and sequential logic blocks with the device’s 952,000 logic elements and embedded RAM.
• High-pin-count interface hubs — Use the 696 I/Os to aggregate and route multiple peripherals, sensors, or parallel interfaces on complex PCBs.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) supports deployment in factory or harsh-environment systems.

Unique Advantages

• Massive logic capacity: 952,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM minimizes external memory requirements for many data-intensive tasks.
• Large I/O complement: 696 I/Os enable dense connectivity and flexible partitioning of interfaces at board-level.
• Industrial-grade thermal range: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Robust packaging: 1517-BBGA/1517-HBGA package options (45×45) support high pin-count routing for compact system designs.
• RoHS compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGXMBBR2H40I2LN?

The 5SGXMBBR2H40I2LN combines very high logic density, substantial embedded memory, and a broad I/O set in a single industrial-grade Stratix V GX FPGA package. This combination makes it well suited for designs that demand on-chip consolidation of complex digital functions while maintaining reliability across a wide temperature range.

Choose this device when you need scalable logic capacity and on-chip memory to reduce external components, alongside the I/O resources and packaging required for high‑pin-count applications. Its specifications support long-term deployments where robustness and integration are priorities.

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