5SGXMBBR1H43I2G

The 5SGXMBBR1H43I2G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) IC provided in a high-pin-count FCBGA package. This device delivers large programmable logic capacity, substantial embedded memory, and a comprehensive I/O count for demanding industrial designs.

Designed for engineers requiring high-density programmable logic, this Stratix V GX device targets complex digital processing, high‑I/O systems, and applications that require industrial temperature operation and fine-grained power supply control.

Key Features

• Stratix V GX FPGA core — Part of the Stratix V GX family, providing the architecture and capabilities associated with this device class.
• Logic capacity — Approximately 952,000 logic elements to implement large-scale, high‑complexity logic designs.
• Embedded memory — Approximately 53.25 Mbits of on‑chip RAM for buffering, FIFOs, and data‑centric logic functions.
• I/O resources — 600 total I/O pins to support wide parallel interfaces and high‑pin‑count system connectivity.
• Power supply range — Core supply specified from 870 mV to 930 mV to match system power‑rail design requirements.
• Package and mounting — 1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45); surface‑mount device for modern PCB assembly.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS compliant — Meets lead‑free and hazardous‑substance requirements for environmental compliance.

Unique Advantages

• High programmable density: Roughly 952k logic elements enable consolidation of complex subsystems into a single FPGA device, reducing board-level component count.
• Significant on‑chip RAM: Approximately 53.25 Mbits of embedded memory supports large buffers and local data storage to improve system throughput.
• Extensive I/O capability: 600 I/Os provide flexibility for interfacing with wide buses, parallel sensors, and high‑channel-count peripherals.
• Industrial thermal range: Operation from −40 °C to 100 °C helps ensure reliable operation across a wide range of industrial conditions.
• High‑pin‑count package: The 1760‑BBGA/1760‑HBGA (45×45) form factor enables dense routing and high connectivity while remaining compatible with standard surface‑mount assembly.
• Regulatory readiness: RoHS compliance supports deployments where hazardous‑substance regulations are required.

Why Choose 5SGXMBBR1H43I2G?

The 5SGXMBBR1H43I2G balances very large programmable logic capacity, substantial embedded memory, and an extensive I/O complement within a high‑pin‑count BGA package rated for industrial temperatures. This combination makes it well suited for complex, high‑integration designs where board‑level consolidation and robust environmental performance are priorities.

Engineers and procurement teams selecting this device will find a platform that supports dense logic implementation, significant local RAM resources, and flexible interfacing options, backed by Intel's Stratix V GX family documentation and device characterization.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXMBBR1H43I2G.