5SGXMBBR1H43C2LG

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA

Quantity 278 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMBBR1H43C2LG – Stratix® V GX Field Programmable Gate Array (FPGA), 1760‑BBGA, 600 I/O

The 5SGXMBBR1H43C2LG is an Intel Stratix® V GX family FPGA in a 1760‑BBGA (FCBGA) package designed for high‑density programmable logic applications. This device integrates 952,000 logic elements and approximately 53.25 Mbits of embedded memory, providing substantial on‑chip resources for complex algorithm implementation and data buffering.

With 600 user I/O pins, a commercial operating range of 0 °C to 85 °C, and a core supply window of 820 mV to 880 mV, this surface‑mount FPGA targets designs that require large logic capacity, abundant memory, and extensive I/O integration.

Key Features

  • Core Logic Density  952,000 logic elements for large, high‑gate‑count designs and complex custom logic implementation.
  • Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support data buffering, FIFOs, and on‑chip storage needs.
  • I/O Capacity & Package  600 I/O pins in a 1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45) for compact, board‑level integration.
  • Transceiver Capability (Family)  Stratix V GX devices (family) include transceiver speed grades documented in the device datasheet (GX channel speed grades up to 14.1 Gbps where applicable to GX devices).
  • Power Supply  Core operating voltage range specified at 820 mV to 880 mV to match system power delivery requirements.
  • Operating Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation.
  • Mounting & Compliance  Surface mount package; RoHS compliant for regulatory and environmental compatibility.

Typical Applications

  • High‑density FPGA compute  Implement large custom accelerators, signal processing chains, and algorithmic pipelines using the device’s nearly one million logic elements and substantial embedded RAM.
  • High‑I/O system integration  Use the 600 I/O pins to aggregate and interface with large numbers of peripherals, sensors, or board‑level subsystems.
  • High‑speed serial and transceiver designs  Leverage the Stratix V GX family transceiver speed grades (as documented in the device datasheet) where high‑throughput serial links are required.

Unique Advantages

  • Massive logic capacity: 952,000 logic elements reduce the need for multi‑FPGA partitioning in large designs.
  • Significant on‑chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and on‑chip data handling without external memory for many functions.
  • Extensive I/O in a compact package: 600 I/O pins in a 1760‑BBGA package enable dense system interfaces while conserving PCB area.
  • Commercial‑grade operation: Rated for 0 °C to 85 °C and a defined core voltage window (820–880 mV) for predictable thermal and power planning.
  • Standards‑aligned family performance: Stratix V GX family transceiver speed grades documented in the datasheet support designs requiring multi‑Gbps serial connectivity.
  • RoHS compliant: Meets RoHS environmental requirements for easier regulatory compliance in commercial products.

Why Choose 5SGXMBBR1H43C2LG?

The 5SGXMBBR1H43C2LG delivers a combination of very high logic density, substantial embedded memory, and broad I/O capacity in a single commercial‑grade Stratix V GX FPGA package. It is suited to designers who need to implement large, integrated FPGA systems—such as high‑capacity data processing, multi‑interface aggregation, and designs that leverage family transceiver capabilities—while maintaining predictable power and thermal parameters.

Choosing this device provides scalability for complex designs that require large on‑chip resources and dense I/O integration, packaged in a surface‑mount 1760‑BBGA footprint and backed by the Stratix V family documentation and specifications.

Request a quote or submit a product inquiry to get pricing, availability, and procurement details for the 5SGXMBBR1H43C2LG.

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