5SGXMB9R3H43I4N

The 5SGXMB9R3H43I4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-I/O programmable logic applications. This device integrates approximately 840,000 logic elements and approximately 53.25 Mbits of embedded memory, providing substantial on‑chip resources for complex logic, buffering, and data processing needs.

Packaged in a 1760‑BBGA (supplier device package: 1760‑HBGA, 45×45) surface-mount form factor, the device supports up to 600 I/Os and is specified for industrial operation from –40 °C to 100 °C with a core supply voltage range of 820 mV to 880 mV. RoHS compliance is included.

Key Features

• Core Logic  Approximately 840,000 logic elements for implementing large-scale programmable logic and custom hardware acceleration.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support data buffering, FIFOs, and tightly coupled memory structures.
• I/O Capacity & Packaging  Up to 600 I/Os in a high-density 1760‑BBGA package (supplier package: 1760‑HBGA, 45×45) to support complex board-level connectivity and high-pin-count designs.
• Power and Core Supply  Core supply range of 820 mV to 880 mV to match system power architectures and enable predictable core power budgeting.
• Thermal & Grade  Industrial grade device specified for operation from –40 °C to 100 °C, suitable for temperature-challenging environments.
• Mounting & Compliance  Surface-mount FCBGA package and RoHS compliance for modern assembly and regulatory requirements.

Unique Advantages

• High integration density: The combination of ~840,000 logic elements and ~53.25 Mbits of embedded memory reduces external component needs and simplifies complex system designs.
• Large I/O footprint: Up to 600 I/Os in a 1760‑BBGA package enables extensive board-level interfacing without sacrificing package density.
• Industrial temperature range: Specified operation from –40 °C to 100 °C supports deployments in demanding thermal environments.
• Predictable core power: Narrow core voltage window (820 mV–880 mV) provides clear parameters for power supply design and thermal planning.
• Surface-mount FCBGA packaging: High-pin-count BGA form factor facilitates dense, repeatable assembly in volume production.
• Regulatory readiness: RoHS compliance eases integration into global production and regulatory workflows.

Why Choose 5SGXMB9R3H43I4N?

The 5SGXMB9R3H43I4N positions itself as a high-capacity Stratix V GX FPGA option for designs that require substantial programmable logic, abundant on-chip memory, and a large number of I/Os in a single package. Its industrial temperature rating and defined core-voltage range make it suitable for robust embedded and industrial systems that demand predictable electrical and thermal behavior.

Choose this device when your design requires dense logic resources, significant embedded RAM, and a high I/O count in a surface-mount 1760‑BBGA package, backed by RoHS compliance and industrial operating specifications.

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