5SGXMB9R3H43I3LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 420 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB9R3H43I3LG – Stratix® V GX Field Programmable Gate Array, 1760-BBGA (Industrial)
The 5SGXMB9R3H43I3LG is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1760-ball BGA package, offered for industrial-grade designs. It provides a high logic-density programmable fabric with substantial embedded memory and a large I/O complement for complex, high-channel-count systems.
Designed around the Stratix V GX architecture, this device supports the series’ electrical and switching characteristics as documented in the Stratix V device datasheet and is targeted at systems that require dense logic, significant on-chip RAM, and robust I/O capability while operating across an industrial temperature range.
Key Features
- Programmable Logic Capacity — 840,000 logic elements (cells) provide a high-density fabric for implementing complex digital functions, pipeline stages, and custom accelerators.
- Embedded Memory — Approximately 53.25 Mbits of on-chip RAM available for buffering, FIFOs, and state storage to support data-intensive designs.
- I/O and Packaging — 600 device I/O pins in a 1760-BBGA FCBGA package; supplier package reference 1760-HBGA (45×45) supports compact board-level integration and high pin-count routing.
- Power and Core Voltage — Core supply operating range from 820 mV to 880 mV to match system power-rail designs for the Stratix V family.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
- Surface Mount Assembly — Surface-mount device suitable for modern PCB assembly processes and high-density system boards.
- Regulatory Compliance — RoHS compliant.
- Series-Level Transceiver Capability (Series Datasheet) — The Stratix V GX family includes high-speed transceiver options as described in the series datasheet for designs that require serial data connectivity.
Typical Applications
- High-performance programmable logic — Use the device to implement large-scale custom logic, datapath processing, and protocol engines where substantial logic elements and on-chip RAM are required.
- High I/O, multi-channel systems — 600 I/O pins enable connectivity for multi-lane interfaces, parallel sensor arrays, and dense peripheral integration.
- Industrial and ruggedized equipment — Industrial temperature rating supports deployment in factory automation, test equipment, and control systems with extended temperature ranges.
Unique Advantages
- High logic density: 840,000 logic elements support complex SoC-style implementations and extensive custom logic integration on a single device.
- Large embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces external memory dependency for buffering and latency-sensitive storage.
- Extensive I/O capability: 600 I/O pins simplify board-level design for multi-interface or multi-channel architectures, minimizing external multiplexing.
- Industrial robustness: −40 °C to 100 °C operating range enables use in environments that require extended temperature tolerances.
- Compact, high-pin-count package: 1760-ball BGA (1760-HBGA supplier reference) balances high interconnect density with a compact PCB footprint.
- Low-voltage core operation: Core supply range (820–880 mV) aligns with modern low-voltage power architectures for efficient system power design.
Why Choose 5SGXMB9R3H43I3LG?
The 5SGXMB9R3H43I3LG brings high logic capacity, substantial on-chip RAM, and a large I/O count within an industrial-temperature-rated Stratix V GX package—making it suitable for demanding programmable-logic applications that require integration, density, and environmental resilience. Its combination of resources supports consolidation of functions onto a single FPGA, reducing board-level complexity and external component needs.
This device is positioned for designers and teams building industrial systems, high-channel-count interfaces, or advanced digital processing solutions that need verified Stratix V series electrical and switching characteristics and a high-density BGA footprint.
Request a quote or submit a purchasing inquiry to obtain pricing and availability for the 5SGXMB9R3H43I3LG. Our team will respond with lead-time and ordering options tailored to your project requirements.

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