5SGXMB9R3H43C3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 524 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB9R3H43C3N – Stratix® V GX FPGA, 840,000 logic cells, ~53 Mbits embedded RAM, 600 I/O, 1760‑BBGA
The 5SGXMB9R3H43C3N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1760‑BBGA FCBGA package. It provides a high-density programmable fabric with large on‑chip memory and extensive I/O, combined with the Stratix V GX family’s documented support for high‑speed transceiver and core/periphery performance.
This device is suited to designs that require substantial logic capacity, significant embedded memory, and a high I/O count while operating within commercial temperature grades and a low‑voltage core supply range.
Key Features
- Core Logic 840,000 logic elements (cells) and approximately 317,000 CLBs provide substantial programmable logic capacity for complex digital designs.
- Embedded Memory Approximately 53 Mbits of on‑chip RAM (53,248,000 bits) to support large buffering, lookup tables, and on‑chip data storage.
- I/O Capability 600 user I/O pins enable wide external interfacing and connectivity for multi‑lane and multi‑bus systems.
- Transceiver and Switching Characteristics (Series) As a Stratix V GX device, the family documentation covers transceiver specifications and periphery switching characteristics for high‑speed serial implementations (see series datasheet for family‑level transceiver speed options).
- Power and Voltage Core voltage supply range from 820 mV to 880 mV to match platform power delivery and low‑voltage core requirements.
- Package and Mounting 1760‑BBGA FCBGA package (supplier device package: 1760‑HBGA, 45×45 mm) in a surface‑mount form factor for system integration.
- Operating Grade Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Standards Compliance RoHS compliant.
Typical Applications
- High‑density digital processing Implement large custom logic blocks, state machines, and datapath architectures using the device’s 840,000 logic cells and extensive CLB resources.
- On‑chip buffering and memory‑intensive functions Use approximately 53 Mbits of embedded RAM for frame buffering, large FIFOs, or LUT‑based storage within the FPGA fabric.
- High‑I/O systems Leverage 600 I/O pins for multi‑lane interfaces, parallel buses, or complex board‑level interconnect requirements.
- High‑speed serial/peripheral integration (family level) Design serial link and periphery logic informed by Stratix V GX family transceiver and switching specifications documented in the series datasheet.
Unique Advantages
- Large programmable fabric: 840,000 logic cells and ~317,000 CLBs allow implementation of complex algorithms and large state machines without partitioning across multiple devices.
- Substantial on‑chip memory: Approximately 53 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- Extensive I/O count: 600 I/O pins enable direct connection to a wide range of peripherals and parallel interfaces, simplifying board design.
- Commercial operating range: Rated 0 °C to 85 °C for mainstream embedded and communications systems operating in commercial environments.
- Compact BGA package: 1760‑BBGA (1760‑HBGA, 45×45 mm) surface‑mount package supports dense system integration while providing high pin count.
- Low‑voltage core supply: 820–880 mV core voltage range supports designs targeting modern low‑voltage power architectures.
Why Choose 5SGXMB9R3H43C3N?
The 5SGXMB9R3H43C3N delivers a significant balance of logic capacity, embedded memory, and I/O density in a single Stratix V GX‑family FPGA. It is positioned for designers who need a programmable platform capable of handling large logic implementations and memory‑intensive functions, while fitting into a high‑pin‑count BGA footprint and operating within commercial temperature limits.
Choosing this device provides a scalable platform rooted in the Stratix V GX family documentation for transceiver and switching characteristics, enabling engineering teams to architect robust systems that leverage the device’s high logic density and on‑chip memory resources.
Request a quote or submit a purchase inquiry to receive pricing and availability information for the 5SGXMB9R3H43C3N Stratix V GX FPGA.

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