5SGXMB9R3H43C3N

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 524 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB9R3H43C3N – Stratix® V GX FPGA, 840,000 logic cells, ~53 Mbits embedded RAM, 600 I/O, 1760‑BBGA

The 5SGXMB9R3H43C3N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1760‑BBGA FCBGA package. It provides a high-density programmable fabric with large on‑chip memory and extensive I/O, combined with the Stratix V GX family’s documented support for high‑speed transceiver and core/periphery performance.

This device is suited to designs that require substantial logic capacity, significant embedded memory, and a high I/O count while operating within commercial temperature grades and a low‑voltage core supply range.

Key Features

  • Core Logic  840,000 logic elements (cells) and approximately 317,000 CLBs provide substantial programmable logic capacity for complex digital designs.
  • Embedded Memory  Approximately 53 Mbits of on‑chip RAM (53,248,000 bits) to support large buffering, lookup tables, and on‑chip data storage.
  • I/O Capability  600 user I/O pins enable wide external interfacing and connectivity for multi‑lane and multi‑bus systems.
  • Transceiver and Switching Characteristics (Series)  As a Stratix V GX device, the family documentation covers transceiver specifications and periphery switching characteristics for high‑speed serial implementations (see series datasheet for family‑level transceiver speed options).
  • Power and Voltage  Core voltage supply range from 820 mV to 880 mV to match platform power delivery and low‑voltage core requirements.
  • Package and Mounting  1760‑BBGA FCBGA package (supplier device package: 1760‑HBGA, 45×45 mm) in a surface‑mount form factor for system integration.
  • Operating Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Standards Compliance  RoHS compliant.

Typical Applications

  • High‑density digital processing  Implement large custom logic blocks, state machines, and datapath architectures using the device’s 840,000 logic cells and extensive CLB resources.
  • On‑chip buffering and memory‑intensive functions  Use approximately 53 Mbits of embedded RAM for frame buffering, large FIFOs, or LUT‑based storage within the FPGA fabric.
  • High‑I/O systems  Leverage 600 I/O pins for multi‑lane interfaces, parallel buses, or complex board‑level interconnect requirements.
  • High‑speed serial/peripheral integration (family level)  Design serial link and periphery logic informed by Stratix V GX family transceiver and switching specifications documented in the series datasheet.

Unique Advantages

  • Large programmable fabric: 840,000 logic cells and ~317,000 CLBs allow implementation of complex algorithms and large state machines without partitioning across multiple devices.
  • Substantial on‑chip memory: Approximately 53 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • Extensive I/O count: 600 I/O pins enable direct connection to a wide range of peripherals and parallel interfaces, simplifying board design.
  • Commercial operating range: Rated 0 °C to 85 °C for mainstream embedded and communications systems operating in commercial environments.
  • Compact BGA package: 1760‑BBGA (1760‑HBGA, 45×45 mm) surface‑mount package supports dense system integration while providing high pin count.
  • Low‑voltage core supply: 820–880 mV core voltage range supports designs targeting modern low‑voltage power architectures.

Why Choose 5SGXMB9R3H43C3N?

The 5SGXMB9R3H43C3N delivers a significant balance of logic capacity, embedded memory, and I/O density in a single Stratix V GX‑family FPGA. It is positioned for designers who need a programmable platform capable of handling large logic implementations and memory‑intensive functions, while fitting into a high‑pin‑count BGA footprint and operating within commercial temperature limits.

Choosing this device provides a scalable platform rooted in the Stratix V GX family documentation for transceiver and switching characteristics, enabling engineering teams to architect robust systems that leverage the device’s high logic density and on‑chip memory resources.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the 5SGXMB9R3H43C3N Stratix V GX FPGA.

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