5SGXMB9R3H43C4G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 850 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB9R3H43C4G – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 840,000 logic elements, 600 I/Os, 1760-BBGA FCBGA
The 5SGXMB9R3H43C4G is a Stratix V GX field programmable gate array (FPGA) designed for logic- and I/O-dense applications. As a GX-class Stratix V device, it delivers a large configurable fabric and extensive I/O capacity in a compact FCBGA package.
With 840,000 logic elements, approximately 53.25 Mbits of embedded RAM, and up to 600 user I/Os, this commercial-grade FPGA targets high-density compute, networking, and signal-processing designs that require significant on-chip resources and flexible I/O integration.
Key Features
- Core / Logic Provides 317,000 LABs and 840,000 logic elements for complex combinational and sequential logic implementations.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM (53,248,000 bits) to support large buffering, lookup tables, and local data storage.
- I/O Density Up to 600 user I/Os to enable broad external connectivity and multi-channel interfaces.
- Power Core voltage supply range of 820 mV to 880 mV to match system power budgeting and core-voltage domains.
- Package & Mounting 1760-BBGA FCBGA package (supplier device package: 1760-HBGA, 45 × 45 mm) with surface-mount mounting for high-density board integration.
- Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory Compliance RoHS compliant for environmentally conscious designs.
Typical Applications
- High-density Networking and Switching Leverage the 600 I/Os and extensive logic fabric for packet processing, bridging, and interface aggregation in network equipment.
- Compute Acceleration and FPGA Offload Use the large logic element count and embedded RAM to implement custom accelerators for enterprise compute and storage systems.
- High-performance Signal Processing Implement multi-channel DSP pipelines and buffering with the combination of dense logic and approximately 53.25 Mbits of on-chip memory.
- Prototyping Complex SoCs Ideal for validating complex hardware functions and system integration where significant programmable logic and I/O are required.
Unique Advantages
- High Logic Capacity: 840,000 logic elements enable large-scale, complex designs without immediate partitioning across multiple devices.
- Substantial On‑Chip Memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for buffering and working datasets.
- Extensive I/O Count: Up to 600 user I/Os simplify multi-channel interfacing and reduce external multiplexing needs.
- Compact FCBGA Footprint: 1760-BBGA / 1760-HBGA (45 × 45 mm) packaging supports high-density PCB layouts while maintaining surface-mount compatibility.
- Commercial-grade Operating Range: Rated 0 °C to 85 °C for standard commercial deployments and controlled-environment systems.
- RoHS Compliance: Meets environmental regulations for lead-free manufacturing flows.
Why Choose 5SGXMB9R3H43C4G?
This Stratix V GX FPGA balances very high logic density, substantial embedded memory, and a high I/O count in a single commercial-grade FCBGA package. It is suited for developers and system designers building logic- and I/O-intensive solutions such as networking, compute acceleration, and advanced signal-processing systems.
Choosing 5SGXMB9R3H43C4G provides a scalable, resource-rich platform that simplifies system integration by consolidating logic, memory, and I/O capability into one device while adhering to RoHS requirements and common commercial operating conditions.
Request a quote or submit an inquiry to receive pricing and availability for 5SGXMB9R3H43C4G and to discuss fit for your project requirements.

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