5SGXMB9R3H43I3LN

The 5SGXMB9R3H43I3LN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, delivering high logic density and extensive I/O in a 1760-BBGA FCBGA package. It is part of the Stratix V GX device family described in the product datasheet and is intended for designs that require large amounts of programmable logic, embedded memory, and high pin-count connectivity.

Key technical attributes include 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and support for 600 I/O pins. The device is offered in an industrial temperature grade and is specified for surface-mount assembly.

Key Features

• Logic Capacity — 840,000 logic elements to implement large-scale programmable logic and complex custom functions.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, packet storage, and intermediate data processing.
• High I/O Count — 600 I/Os to support dense board-level connectivity and multiple parallel interfaces.
• Package and Mounting — 1760-BBGA, FCBGA package; supplier device package identified as 1760-HBGA (45×45). Designed for surface-mount assembly.
• Power Supply Range — Voltage supply specified from 820 mV to 880 mV.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C.
• RoHS Compliant — Meets lead-free regulations indicated by RoHS compliance.
• Stratix V GX Family Characteristics — Device belongs to the Stratix V GX series described in the datasheet, which documents the family’s electrical and switching characteristics, including transceiver and I/O timing details.

Typical Applications

• High-speed communication systems — Large logic capacity and Stratix V GX family transceiver characteristics make this device suitable for demanding serial-link and protocol-bridging applications.
• Data processing and acceleration — Extensive embedded memory and high logic element count support complex datapath implementation and packet processing engines.
• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) and high I/O count enable robust interfacing in industrial environments.
• High-density I/O platforms — 600 I/Os accommodate multiport designs, mezzanine interfaces, and systems requiring extensive external connectivity.

Unique Advantages

• High logic density: 840,000 logic elements provide headroom for large, integrated designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive connectivity: 600 I/Os enable flexible board-level interfacing and support for numerous parallel and serial links.
• Industrial-grade operation: Specified operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, manufacturable package: 1760-BBGA/1760-HBGA (45×45) package supports surface-mount assembly for high-density PCB designs.
• Controlled core supply window: 820 mV to 880 mV supply specification supports predictable power and thermal planning.

Why Choose 5SGXMB9R3H43I3LN?

The 5SGXMB9R3H43I3LN positions itself for projects that require substantial programmable logic, abundant on-chip memory, and a large number of I/Os within an industrial temperature envelope. As a member of the Stratix V GX family from Intel, the device is documented within a datasheet that covers the family’s electrical, switching, and I/O timing characteristics—information valuable for system-level design and validation.

This device is suited to engineering teams building high-density, high-throughput systems that need integrated memory and extensive connectivity while operating across a wide temperature range. Its package and surface-mount form factor support modern PCB manufacturing and compact system layouts.

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