5SGXMB9R3H43I3G

The 5SGXMB9R3H43I3G is an Intel Stratix® V GX FPGA in a 1760‑BBGA FCBGA package, designed for high-density programmable logic implementations. This industrial‑grade device delivers large logic capacity, abundant on‑chip memory, and extensive I/O to support complex, performance‑oriented digital designs.

Key value comes from its combination of approximately 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 600 I/Os, making it suitable for systems that require high integration, flexible reprogrammability, and wide operational temperature range.

Key Features

• Logic Capacity  Approximately 840,000 logic elements to implement large, complex digital designs and custom acceleration blocks.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM for buffering, look‑up tables, and state storage without external memory for many functions.
• I/O Density  Up to 600 I/Os to interface with a wide range of peripherals, high‑speed peripherals, and external devices.
• Transceiver Family  Part of the Stratix V GX family; Stratix V GX devices are offered in multiple transceiver speed grades as documented in the device datasheet.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match designed power rails and system power budgets.
• Industrial Grade & Temperature Range  Industrial grade device with operating temperature from –40 °C to 100 °C for deployment in demanding environments.
• Package & Mounting  1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45). Surface mount device for high‑density PCB designs.
• RoHS Compliant  Meets RoHS requirements for lead‑free manufacturing and regulatory conformity.

Typical Applications

• High‑performance digital processing  Use the large logic capacity and abundant embedded memory for compute‑intensive FPGA acceleration, signal processing, and algorithm offload.
• Communications & Networking  Leverage the Stratix V GX family transceiver capabilities and high I/O count for packet processing, switching, and protocol bridging.
• Industrial Control & Instrumentation  Industrial temperature rating and extensive I/O make this device suitable for rugged control systems and instrumentation that require deterministic programmable logic.
• Custom System Integration  High integration reduces external component count for mixed‑function systems combining control, interfacing, and data handling on a single FPGA.

Unique Advantages

• High logic and memory integration: Approximately 840,000 logic elements and ~53.25 Mbits of embedded RAM reduce reliance on external logic and memory parts, simplifying BOM and board layout.
• Extensive I/O capacity: Up to 600 I/Os enable flexible interfacing to sensors, ADCs/DACs, SerDes lanes, and system buses without immediate need for expansion chips.
• Industrial temperature operation: Rated for –40 °C to 100 °C, supporting deployments where wide thermal ranges are required.
• Compact, surface‑mount package: 1760‑BBGA (FCBGA)/1760‑HBGA (45×45) packaging provides high pin density in a compact footprint for space‑constrained designs.
• Controlled core voltage range: 820 mV–880 mV core supply allows precise power budgeting and compatibility with board power architectures.
• Regulatory readiness: RoHS compliance supports use in regulated manufacturing environments focused on lead‑free assembly.

Why Choose 5SGXMB9R3H43I3G?

The 5SGXMB9R3H43I3G positions itself as a high‑capacity, industrial‑grade Stratix V GX FPGA that combines large programmable logic density, substantial on‑chip memory, and high I/O count in a compact FCBGA package. Its specified core voltage range and wide operating temperature make it appropriate for demanding system designs that require robust performance and long‑term deployment stability.

Engineers and system designers targeting complex signal processing, high‑throughput networking, or integrated industrial control platforms will find this device suited to applications where integration, configurability, and thermal tolerance are key design drivers.

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