5SGXMB9R3H43C4N

The 5SGXMB9R3H43C4N is a Stratix V GX family Field Programmable Gate Array (FPGA) IC designed for high‑density, high‑integration digital designs. It provides a large complement of logic resources and on‑chip memory to implement complex custom logic, packet processing, and multi‑interface systems.

As a member of the Stratix V GX series, this device targets designs that require substantial embedded memory and I/O capacity while operating within commercial temperature and power envelopes.

Key Features

• Logic Capacity — 840,000 logic elements for implementing large, parallelized logic functions and custom datapaths.
• Embedded Memory — Approximately 53 Mbits of on‑chip RAM (53,248,000 bits) to support large buffering, FIFOs, and on‑chip storage.
• I/O Density — 600 user I/Os to enable high‑port count interfacing and flexible board-level connectivity.
• Package and Mounting — 1760‑BBGA (FCBGA) package; supplier device package noted as 1760‑HBGA (45×45). Surface mount construction for standard PCB assembly.
• Power Supply — Core supply operating range from 820 mV to 880 mV to match specified core voltage rails.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High‑density digital processing — Implement complex signal processing, packet processing, or custom compute pipelines using the device’s large logic and memory resources.
• Multi‑interface systems — Support designs needing many external connections and protocol bridging with 600 available I/Os.
• Embedded buffering and memory‑intensive logic — Use the approximately 53 Mbits of on‑chip RAM for FIFOs, large lookup tables, and temporary data storage.

Unique Advantages

• Extensive logic resource pool: 840,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level part count.
• Substantial on‑chip memory: Approximately 53 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
• High I/O count: 600 I/Os simplify routing of wide buses, multi‑lane interfaces, and numerous peripherals without external multiplexing.
• Commercial temperature rating: Rated for 0 °C to 85 °C to match standard commercial electronic product requirements.
• Surface mount BBGA packaging: 1760‑BBGA (1760‑HBGA supplier designation, 45×45) supports compact, high‑density board layouts.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose 5SGXMB9R3H43C4N?

The 5SGXMB9R3H43C4N combines a very large logic fabric with substantial on‑chip memory and a high I/O count in a single surface‑mount BBGA package. It is positioned for engineers who need to integrate complex digital functions and memory‑heavy logic into compact, commercially rated systems.

For designs that demand consolidation of multiple functions, reduced external component count, and flexible interfacing, this Stratix V GX device provides a scalable platform with verified series characteristics and RoHS compliance, supporting long‑term design stability within commercial operating ranges.

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