5SGXMB9R3H43I3N

The 5SGXMB9R3H43I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for industrial-grade applications that require high logic density, substantial embedded memory, and extensive I/O. As a member of the Stratix V GX family, this device targets designs that need significant on-chip resources and robust operating conditions.

Key value propositions include a large programmable logic fabric (840,000 logic elements), approximately 53.25 Mbits of embedded memory, and up to 600 general‑purpose I/Os—combined with industrial temperature rating and a compact FCBGA/HBGA package for surface-mount assembly.

Key Features

• Core Logic: 840,000 logic elements provide high integration density for complex digital designs and large-scale programmable logic implementations.
• Embedded Memory: Approximately 53.25 Mbits of on-chip RAM to support buffering, large state machines, and memory-intensive algorithms without external memory.
• I/O Capacity: 600 I/O pins for broad connectivity to peripherals, interfaces, and board-level signals.
• Voltage Supply: Core supply range of 820 mV to 880 mV for precise power delivery to the FPGA core.
• Package & Mounting: Available in a 1760‑BBGA FCBGA package (supplier package 1760‑HBGA, 45×45 mm) optimized for surface-mount PCB assembly.
• Temperature Grade: Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance: RoHS compliant.
• Stratix V GX Series Capability: As part of the Stratix V GX family, the series documentation includes GX transceiver speed grades (series-level data) for designs that utilize high-speed serial links.

Typical Applications

• High‑density digital signal processing: Use the large logic and on‑chip RAM resources to implement DSP pipelines, FPGAs-based accelerators, and data-path processing.
• Networking and communications systems: High I/O count and Stratix V GX family transceiver capabilities support packet processing, switching, and protocol bridging.
• Industrial control and automation: Industrial temperature rating and extensive I/O make the device suitable for complex control logic, sensor aggregation, and real‑time decision systems.
• Prototyping and system integration: Dense logic and memory resources allow consolidation of multiple functions into a single FPGA for rapid prototyping and system-level integration.

Unique Advantages

• High integration density: 840,000 logic elements reduce the need for multiple discrete devices, simplifying board design and lowering BOM complexity.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM enables large data buffering and local storage without immediate dependence on external memory subsystems.
• Extensive connectivity: 600 I/Os provide flexibility to interface with a wide array of external devices and system buses directly from the FPGA.
• Industrial robustness: Rated for −40 °C to 100 °C operation to support deployment in industrial temperature environments.
• Compact surface-mount packaging: 1760‑BBGA / 1760‑HBGA (45×45) package supports high‑density board layouts while accommodating the device’s pin count and thermal needs.
• Standards‑aware design: RoHS compliance supports environmental and regulatory requirements for modern assemblies.

Why Choose 5SGXMB9R3H43I3N?

The 5SGXMB9R3H43I3N delivers a combination of large programmable logic capacity, significant embedded memory, and a high I/O count in an industrial‑rated FPGA package. This balance of capacity and ruggedness makes it suitable for engineers developing complex digital systems that must operate reliably across extended temperature ranges.

Choose this Stratix V GX device when your design requires consolidation of multiple functions into a single, high‑density FPGA with the on‑chip resources to reduce external components and simplify system architecture. The device’s platform-level capabilities and package options support scalable designs and long-term deployment in industrial environments.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for 5SGXMB9R3H43I3N.