5SGXMB9R3H43I4G

The 5SGXMB9R3H43I4G is a Stratix® V GX field programmable gate array (FPGA) from Intel, providing a high-density programmable fabric in a 1760-BBGA (FCBGA) package. The device combines large logic capacity, substantial on-chip RAM, and a high I/O count to address demanding digital designs.

Designed for industrial-grade operation, this Stratix V GX device is suited to applications that require extensive logic resources, significant embedded memory, and broad external connectivity while operating across a wide temperature and core-voltage range.

Key Features

• Logic Capacity — 840,000 logic elements (cells) to implement large-scale digital designs and complex algorithms.
• Fabric Structure — 317,000 LABs/CLBs equivalent (reported as 317000), providing the building blocks for logic synthesis and placement.
• Embedded Memory — approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive functions.
• I/O Resources — 600 user I/O pins to support extensive external interfaces and parallel connectivity.
• Package and Mounting — 1760-BBGA (FCBGA) package, supplier device package listed as 1760-HBGA (45×45); surface-mount device for board-level integration.
• Power Supply — core voltage supply range of 820 mV to 880 mV to match modern low-voltage FPGA core rails.
• Temperature Grade — industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
• Regulatory — RoHS compliant.
• Stratix V GX Family Capabilities — the Stratix V GX family documentation describes industrial and commercial speed grades and transceiver options across multiple channel data rates.

Typical Applications

• High-density digital designs — implement complex state machines, signal processing, and custom logic with 840,000 logic elements and extensive LAB resources.
• Memory-intensive functions — use approximately 53.25 Mbits of embedded RAM for large buffers, packet memory, and data staging.
• High-pin-count interfaces — leverage 600 I/O pins to connect multiple peripherals, parallel buses, or board-level mezzanine modules.
• Industrial systems — operate across −40 °C to 100 °C for deployments that require industrial temperature resilience.

Unique Advantages

• Large programmable fabric: 840,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
• Significant embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces external memory dependency for many designs.
• High I/O density: 600 I/O pins enable broad interfacing options without compromising board routing flexibility.
• Industrial temperature range: −40 °C to 100 °C operation supports deployments in challenging thermal environments.
• Low-voltage core compatibility: Core supply range of 820 mV–880 mV aligns with contemporary low-voltage FPGA platforms.
• Package options for system integration: 1760-BBGA (FCBGA) in a 45×45 supplier package footprint accommodates high-density PCB layouts.

Why Choose 5SGXMB9R3H43I4G?

The 5SGXMB9R3H43I4G delivers a combination of very large logic capacity, substantial embedded memory, and wide I/O availability in an industrial-grade Stratix V GX device. These documented specifications make it appropriate for designs that need to integrate significant digital functionality while meeting industrial operating-temperature requirements.

Backed by the Stratix V family documentation and Intel’s device characterization, this device is a suitable choice for engineering teams focused on high-density FPGA implementations that require verifiable electrical and switching characteristics.

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