5SGXMB9R3H43C2N

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 500 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB9R3H43C2N – Stratix® V GX FPGA, 840,000 logic elements, ~53.25 Mbits RAM, 600 I/O, 1760-BBGA

The 5SGXMB9R3H43C2N is a Stratix® V GX field programmable gate array (FPGA) IC designed for high-density, programmable logic applications. It combines a large logic fabric and substantial on-chip memory with a high I/O count in a 1760-ball BGA package, making it suitable for complex board-level functions that require extensive logic, buffering, and interface connectivity.

This device is offered in a commercial temperature grade and conforms to RoHS requirements. The Stratix V family datasheet provides additional context on transceiver speed grades and device operating characteristics relevant to system-level design.

Key Features

  • Programmable Logic Capacity Approximately 840,000 logic elements to implement large, complex digital systems and custom accelerators.
  • Embedded Memory Approximately 53.25 Mbits of on-chip RAM for data buffering, FIFOs, and local storage for high-throughput designs.
  • I/O Resources 600 user I/O pins to support dense board-level interfacing and multiple high-pin-count peripherals.
  • Core Voltage Core supply range from 870 mV to 930 mV to match system power-rail design requirements.
  • Package and Mounting 1760-ball BGA (FCBGA / supplier package 1760-HBGA, 45×45 mm), surface-mount package suitable for compact, high-density PCB layouts.
  • Temperature and Grade Commercial grade operation with an ambient range of 0 °C to 85 °C for standard commercial applications.
  • Regulatory Compliance RoHS-compliant construction to meet environmental directive requirements for lead-free assemblies.

Typical Applications

  • High-speed communications and networking — Large logic capacity and family transceiver options support protocol processing, packet buffering, and interface aggregation in networking equipment; consult the Stratix V family datasheet for transceiver grade details.
  • Data processing and acceleration — Substantial logic and embedded memory enable implementation of hardware accelerators, DSP pipelines, and data-parallel processing blocks.
  • Protocol bridging and interface hubs — High I/O count supports dense board-level connectivity and multiple simultaneous interfaces for system integration tasks.

Unique Advantages

  • High compute density: Approximately 840,000 logic elements provide the resources needed for complex, multi-function implementations on a single device.
  • Large on-chip RAM: ~53.25 Mbits of embedded memory reduces external memory dependence for buffering and real-time data handling.
  • Extensive I/O capability: 600 I/O pins enable flexible interfacing and support for multiple high-pin-count peripherals or channels.
  • Compact, manufacturable package: 1760-ball BGA in a 45×45 mm footprint supports high-density PCB assembly and surface-mount manufacturing practices.
  • Commercial-ready: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial product deployments.

Why Choose 5SGXMB9R3H43C2N?

The 5SGXMB9R3H43C2N positions itself as a high-density, commercially graded Stratix V GX FPGA option for engineers requiring substantial logic capacity, embedded memory, and a large I/O complement in a single, surface-mount BGA package. Its specifications make it appropriate for designs that prioritize on-chip resources and board-level connectivity while adhering to commercial temperature ranges and RoHS standards.

For teams building complex communication, data processing, or system-integration solutions, this device offers the integration needed to consolidate multiple functions into a single FPGA-based implementation, with the Stratix V family datasheet available for further device- and transceiver-grade details.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXMB9R3H43C2N FPGA.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up