5SGXMB9R3H43C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 500 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMB9R3H43C2N – Stratix® V GX FPGA, 840,000 logic elements, ~53.25 Mbits RAM, 600 I/O, 1760-BBGA
The 5SGXMB9R3H43C2N is a Stratix® V GX field programmable gate array (FPGA) IC designed for high-density, programmable logic applications. It combines a large logic fabric and substantial on-chip memory with a high I/O count in a 1760-ball BGA package, making it suitable for complex board-level functions that require extensive logic, buffering, and interface connectivity.
This device is offered in a commercial temperature grade and conforms to RoHS requirements. The Stratix V family datasheet provides additional context on transceiver speed grades and device operating characteristics relevant to system-level design.
Key Features
- Programmable Logic Capacity Approximately 840,000 logic elements to implement large, complex digital systems and custom accelerators.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM for data buffering, FIFOs, and local storage for high-throughput designs.
- I/O Resources 600 user I/O pins to support dense board-level interfacing and multiple high-pin-count peripherals.
- Core Voltage Core supply range from 870 mV to 930 mV to match system power-rail design requirements.
- Package and Mounting 1760-ball BGA (FCBGA / supplier package 1760-HBGA, 45×45 mm), surface-mount package suitable for compact, high-density PCB layouts.
- Temperature and Grade Commercial grade operation with an ambient range of 0 °C to 85 °C for standard commercial applications.
- Regulatory Compliance RoHS-compliant construction to meet environmental directive requirements for lead-free assemblies.
Typical Applications
- High-speed communications and networking — Large logic capacity and family transceiver options support protocol processing, packet buffering, and interface aggregation in networking equipment; consult the Stratix V family datasheet for transceiver grade details.
- Data processing and acceleration — Substantial logic and embedded memory enable implementation of hardware accelerators, DSP pipelines, and data-parallel processing blocks.
- Protocol bridging and interface hubs — High I/O count supports dense board-level connectivity and multiple simultaneous interfaces for system integration tasks.
Unique Advantages
- High compute density: Approximately 840,000 logic elements provide the resources needed for complex, multi-function implementations on a single device.
- Large on-chip RAM: ~53.25 Mbits of embedded memory reduces external memory dependence for buffering and real-time data handling.
- Extensive I/O capability: 600 I/O pins enable flexible interfacing and support for multiple high-pin-count peripherals or channels.
- Compact, manufacturable package: 1760-ball BGA in a 45×45 mm footprint supports high-density PCB assembly and surface-mount manufacturing practices.
- Commercial-ready: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial product deployments.
Why Choose 5SGXMB9R3H43C2N?
The 5SGXMB9R3H43C2N positions itself as a high-density, commercially graded Stratix V GX FPGA option for engineers requiring substantial logic capacity, embedded memory, and a large I/O complement in a single, surface-mount BGA package. Its specifications make it appropriate for designs that prioritize on-chip resources and board-level connectivity while adhering to commercial temperature ranges and RoHS standards.
For teams building complex communication, data processing, or system-integration solutions, this device offers the integration needed to consolidate multiple functions into a single FPGA-based implementation, with the Stratix V family datasheet available for further device- and transceiver-grade details.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXMB9R3H43C2N FPGA.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018