5SGXMB9R3H43C2LN

The 5SGXMB9R3H43C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1760-ball BGA (FCBGA) package. This device provides a high-density programmable fabric with substantial embedded memory and flexible I/O for demanding logic implementations.

With 840,000 logic elements and approximately 53.25 Mbits of on-chip RAM, the device is well suited to designs that require large amounts of programmable logic and embedded memory within a surface-mount, commercial-temperature FPGA package.

Key Features

• Core Logic  840,000 logic elements and 317,000 logic array blocks provide a large programmable fabric for complex logic and control functions.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive logic functions.
• I/O Capacity  600 user I/O pins delivered from the 1760-ball FCBGA package to support wide parallel interfaces and dense interconnects.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for the FPGA core power domain.
• Package and Mounting  1760-BBGA (FCBGA) package, supplier device package listed as 1760-HBGA (45×45); surface-mount mounting type for standard PCB assembly processes.
• Temperature Range  Commercial operating temperature range from 0 °C to 85 °C, matching commercial-grade system requirements.
• Compliance  RoHS-compliant manufacturing.

Typical Applications

• High-density signal processing  Large logic capacity and substantial embedded RAM enable DSP pipelines, data path implementation, and custom accelerators.
• Communications and networking  Extensive I/O count and high-density logic fabric support protocol processing, packet handling, and interface bridging.
• Data center and compute accelerators  On-chip memory and programmable logic are suitable for offload engines and custom compute kernels.
• Prototype and system integration  Surface-mount FCBGA packaging and commercial-grade temperature profile simplify integration into development and production PCBs.

Unique Advantages

• High logic density: The combination of 840,000 logic elements and 317,000 logic array blocks enables complex, consolidated implementations that reduce the need for multiple devices.
• Significant on-chip RAM: Approximately 53.25 Mbits of embedded memory minimizes external memory dependence for buffering and temporary storage.
• Extensive I/O resources: 600 I/O pins in a single 1760-BBGA package allow broad connectivity for parallel interfaces and multi-channel systems.
• Commercial-grade thermal profile: Rated 0 °C to 85 °C for applications targeting commercial environments and standard operational ranges.
• Compact surface-mount packaging: 1760-ball FCBGA (45×45) delivers high integration density with standard SMT assembly methods.
• RoHS compliance: Manufactured to meet RoHS environmental requirements for lead-free production.

Why Choose 5SGXMB9R3H43C2LN?

The 5SGXMB9R3H43C2LN positions itself as a high-density Stratix V GX FPGA option for commercial designs that require substantial programmable logic, on-chip memory, and extensive I/O within a single-package solution. Its voltage and temperature ratings, along with RoHS compliance and surface-mount BGA packaging, make it suitable for modern PCB integration where space and performance are priorities.

Engineers and system designers seeking to consolidate multiple functions into one programmable device will find the device’s logic capacity and embedded memory advantageous for scalable, reliable implementations supported by the Stratix V family documentation.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXMB9R3H43C2LN.