5SGXMB9R2H43I3LN

The 5SGXMB9R2H43I3LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1760-BBGA FCBGA package for surface-mount applications. It combines a high logic element count and substantial on-chip RAM with a large I/O complement, targeting complex digital designs that require dense programmable logic and extensive external connectivity.

Built for industrial temperature operation, this device supports core voltages in the 820 mV to 880 mV range and is RoHS compliant, making it suitable for deployed systems that demand reliable operation across a wide thermal range.

Key Features

• High Logic Density 840,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory Approximately 53.2 Mbits of on-chip RAM for buffering, packet processing, and state storage.
• Extensive I/O 600 user I/O pins to support multi-channel interfaces and broad system integration.
• Transceiver Speed Grades (Series) Stratix V GX devices are offered with transceiver speed grade options documented in the series datasheet (including GX channel grades up to 14.1 Gbps).
• Power Supply Core supply voltage range of 820 mV to 880 mV, providing defined operation envelope for power delivery design.
• Package & Mounting 1760-BBGA (FCBGA) package, supplier device package listed as 1760-HBGA (45×45); surface-mount mounting type for PCB assembly.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for industrial applications.
• Regulatory Compliance RoHS compliant.

Typical Applications

• High-density digital processing — Implement complex pipelines, signal processing blocks, and custom accelerators using the large logic element count and embedded RAM.
• Multi-channel I/O systems — Support systems that require many parallel interfaces or large numbers of external peripherals with 600 I/O pins.
• Industrial control and automation — Use the industrial temperature rating and robust packaging for deployed control systems and machine-level integration.
• Network and communications equipment — Leverage the Stratix V GX series transceiver capabilities and high logic density for protocol offload, aggregation, and packet processing tasks.

Unique Advantages

• Large programmable fabric: 840,000 logic elements provide capacity for highly parallel architectures and complex state machines.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces external memory dependency for many buffering and scratchpad needs.
• High I/O count: 600 I/O pins enable flexible connectivity to multiple subsystems and mezzanine modules without immediate external I/O expanders.
• Industrial-grade operating range: −40 °C to 100 °C supports deployment in harsher environments and industrial installations.
• Defined core power envelope: 820 mV–880 mV supply range assists in planning power delivery and thermal management.
• Manufacturer documentation: Backed by Intel (Altera) Stratix V family documentation and electrical characteristics for design and validation.

Why Choose 5SGXMB9R2H43I3LN?

The 5SGXMB9R2H43I3LN delivers a combination of very high logic capacity, significant embedded RAM, and a large I/O complement in a surface-mount 1760-BBGA package, positioned for industrial applications that require dense programmable logic and extensive external connectivity. Its documented operating voltage range and industrial temperature rating make it suitable for robust system designs where defined electrical and thermal behavior matter.

This device is appropriate for engineering teams building scalable, high-density digital systems that benefit from the Stratix V GX family’s transceiver options and detailed manufacturer specifications. Use it when on-chip logic capacity, embedded memory, and I/O density are central to your architecture.

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