5SGXMB9R2H43I3LG

The 5SGXMB9R2H43I3LG is an Intel Stratix® V GX family FPGA featuring very high logic density and substantial on-chip memory. This Stratix V GX FPGA is designed for applications that require large programmable logic capacity, extensive I/O, and robust industrial temperature operation.

Key architectural highlights include 840,000 logic elements, approximately 53.2 Mbits of embedded memory, and support for up to 600 I/O pins, combined in a surface-mount 1760-BBGA (FCBGA) package. The device is offered in an industrial grade with operating conditions and electrical characteristics defined in the Stratix V device datasheet.

Key Features

• Logic Capacity 840,000 logic elements providing very high programmable logic density for complex designs.
• Embedded Memory Approximately 53.2 Mbits of on-chip RAM for buffering, packet buffering, and algorithm implementations.
• I/O Density Up to 600 I/O pins to support extensive peripheral, interface, and bus connectivity.
• Package Surface-mount 1760-BBGA (FCBGA); supplier device package listed as 1760-HBGA (45×45).
• Power Core voltage supply range 820 mV to 880 mV for core power domains.
• Temperature Range Industrial operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant for environmental and manufacturing compatibility.
• Documented Electrical and Switching Characteristics Supported by the Stratix V device datasheet covering operating conditions, power, and transceiver/core performance.

Unique Advantages

• High logic density: 840,000 logic elements enable consolidation of large, complex functions onto a single FPGA die, reducing system-level component count.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM supports large buffering and memory-intensive algorithms without external memory.
• Extensive I/O: 600 I/O pins accommodate numerous interfaces and high-pin-count peripheral connectivity, simplifying board-level routing for feature-rich designs.
• Industrial temperature grade: Rated for −40 °C to 100 °C, supporting use in harsh and industrial environments.
• Compact, high-density package: 1760-BBGA (1760-HBGA supplier package, 45×45) delivers high integration in a surface-mount form factor.
• Standards-compliant manufacturing: RoHS compliance supports modern production and environmental requirements.

Why Choose 5SGXMB9R2H43I3LG?

This Stratix V GX FPGA balances very high programmable logic capacity, significant embedded memory, and a large I/O complement in an industrial-grade, surface-mount package. It is well suited to engineers and teams building complex, high-density programmable designs that require robust operating conditions and extensive on-chip resources.

Backed by the Stratix V device documentation for electrical and switching characteristics, the 5SGXMB9R2H43I3LG offers a clear specification set for power, temperature, and package requirements—helping reduce design uncertainty and speed integration into system-level designs.

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