5SGXMB9R2H43I2LG

The 5SGXMB9R2H43I2LG is a Stratix® V GX field programmable gate array (FPGA) from Intel, offering a high-density programmable fabric for complex digital designs. This device combines a large logic capacity with substantial on-chip RAM and a high count of I/Os to support demanding system integration and I/O‑rich applications.

Designed for industrial-grade operation, the device provides specified supply and thermal ranges and comes in a high‑pin-count ball grid array package suitable for surface‑mount assembly.

Key Features

• High Logic Capacity  Approximately 840,000 logic elements to implement large-scale programmable logic and control functions.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Density  600 user I/Os providing extensive connectivity for high‑pin-count systems and complex board-level interfaces.
• Power and Core Voltage  Core voltage range specified from 820 mV to 880 mV to meet device operating requirements.
• Package and Mounting  1760‑BBGA / FCBGA package (supplier package: 1760‑HBGA, 45×45) in a surface‑mount form factor for PCBA integration.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C, suitable for industrial environment thermal ranges.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑density programmable logic systems  Implement large FPGA designs that require hundreds of thousands of logic elements combined with substantial embedded RAM.
• I/O‑centric interface hubs  Use the 600 I/O pins to aggregate and manage multiple high‑pin interfaces or board-level peripherals.
• Industrial control and automation  Deploy in systems that need industrial temperature operation and robust on‑chip resources for real‑time control and data handling.

Unique Advantages

• High programmable capacity: Approximately 840,000 logic elements enable implementation of complex logic and large custom architectures on a single device.
• Large embedded memory: Approximately 53.25 Mbits of on‑chip RAM reduces the need for external memory in many buffering and data‑path applications.
• Extensive I/O availability: 600 I/Os provide flexibility for dense pinout requirements and multiple simultaneous interfaces.
• Industrial temperature rating: Specified operation from −40°C to 100°C supports deployment in environments with wide temperature swings.
• High‑pin-count BGA package: 1760‑ball BGA packaging allows high routing density and board‑level integration for complex systems.
• RoHS compliant: Meets lead‑free and environmental regulatory expectations for many industrial and commercial products.

Why Choose 5SGXMB9R2H43I2LG?

The 5SGXMB9R2H43I2LG positions itself for designs that require substantial programmable logic, significant on‑chip RAM, and a large number of I/Os within an industrial operating window. Its combination of approximately 840,000 logic elements, roughly 53.25 Mbits of embedded memory, and 600 I/Os makes it suitable for complex, integrated FPGA implementations where board‑level connectivity and local memory are critical.

Backed by Intel’s Stratix V GX family pedigree and delivered in a 1760‑ball BGA surface‑mount package, this device supports long‑term system designs that demand high integration density and industrial temperature robustness.

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