5SGXMB9R2H43I2LN

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 255 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB9R2H43I2LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMB9R2H43I2LN is an Intel (Altera) Stratix® V GX family FPGA offered in a 1760-BBGA (FCBGA) package. This device provides very large programmable logic capacity combined with extensive I/O and on-chip memory, packaged for surface-mount applications.

Engineered for industrial-grade environments, the device supports a core voltage supply range of 820 mV to 880 mV and an operating temperature range from –40 °C to 100 °C, making it suitable for demanding embedded and high-density digital designs.

Key Features

  • Logic Capacity  Provides 840,000 logic elements (cells) for implementing large-scale custom logic and datapaths.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffers, FIFOs, and distributed memory functions.
  • I/O Density  Up to 600 I/O pins to interface with high-pin-count subsystems and parallel buses.
  • Core Supply  Core voltage supply specified from 820 mV to 880 mV for device operation within defined power envelopes.
  • Package and Mounting  1760-BBGA (FCBGA) surface-mount package, supplier device package listed as 1760-HBGA (45×45), optimized for board-level integration.
  • Industrial Temperature Grade  Rated for −40 °C to 100 °C operation for use in industrial temperature environments.
  • Standards Compliance  RoHS compliant.

Typical Applications

  • High-density digital processing  Implement large custom datapaths and control logic using up to 840,000 logic elements and substantial on-chip RAM.
  • High-pin-count system interfaces  Leverage 600 I/Os for complex board-level interconnects, parallel buses, and multi-protocol front-ends.
  • Industrial embedded systems  Use the industrial temperature rating and RoHS compliance for robust deployment in industrial controls and instrumentation.

Unique Advantages

  • Exceptional logic and memory scale: The combination of 840,000 logic elements and approximately 53.25 Mbits of embedded RAM reduces the need for external logic and memory components.
  • High I/O integration: 600 I/Os enable direct interfacing to multiple subsystems, simplifying board design and reducing connector and routing complexity.
  • Industrial operating range: Specified for −40 °C to 100 °C operation to meet the environmental demands of industrial deployments.
  • Compact, board-friendly package: 1760-BBGA (FCBGA) surface-mount package balances high pin count with manageable PCB footprint for dense designs.
  • Controlled core voltage range: Defined 820 mV–880 mV supply simplifies power-supply design for core domains.
  • Regulatory compliance: RoHS compliance supports environmentally conscious procurement and manufacturing requirements.

Why Choose 5SGXMB9R2H43I2LN?

The 5SGXMB9R2H43I2LN brings together very large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-temperature, surface-mount package. These characteristics make it suitable for complex, high-density designs where integration and reliability are priorities.

As a Stratix V GX family device from Intel (Altera), this FPGA is backed by the Stratix V device documentation and series-level data, enabling designers to evaluate device-level electrical and switching characteristics while planning scalable, long-lived hardware platforms.

Request a quote or submit an inquiry for pricing and availability to evaluate 5SGXMB9R2H43I2LN for your next high-density FPGA design.

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