5SGXMB9R2H43C3N

The 5SGXMB9R2H43C3N is an Intel Stratix® V GX family FPGA supplied in a high-pin-count FCBGA package. It delivers very high logic density and substantial on-chip memory capacity for complex digital designs that require extensive routing and I/O resources.

Key attributes include approximately 840,000 logic elements, roughly 53.25 Mbits of embedded RAM, and 600 user I/Os, combined with a commercial operating temperature range and low-voltage core supply for dense, power-aware designs.

Key Features

• Core logic  Approximately 840,000 logic elements to implement large, multi-function digital systems.
• Embedded memory  Approximately 53.25 Mbits of on-chip RAM to support large buffers, packet memories, and algorithm state storage.
• I/O capacity  600 device I/Os for extensive external interfacing and high pin-count system integration.
• Package and mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount device for modern board assembly.
• Power  Core voltage supply range of 820 mV to 880 mV for core power domain planning and supply sequencing.
• Temperature and grade  Commercial operating temperature range of 0 °C to 85 °C.
• Standards compliance  RoHS compliant.

Unique Advantages

• High-density logic integration: The large logic element count enables consolidation of multiple functions into a single device, reducing board-level component count.
• Significant embedded memory: With approximately 53.25 Mbits of RAM on-chip, the device supports complex buffering, large FIFOs, and memory-intensive algorithms without immediate external memory dependence.
• Extensive I/O resources: 600 I/Os allow flexible interfacing to numerous peripherals, daughter cards, or high-channel-count systems.
• Compact high-pin package: The 1760-BBGA/1760-HBGA package provides high pin density in a compact footprint for space-constrained, high-performance PCBs.
• Low-voltage core operation: Defined core supply range (820 mV–880 mV) supports targeted power budgeting and modern low-voltage power architectures.
• Commercial-grade deployment: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic product development.

Why Choose 5SGXMB9R2H43C3N?

This Stratix V GX FPGA is positioned for designs that require very high logic capacity, substantial embedded memory, and a large number of I/Os in a single device footprint. The combination of approximately 840,000 logic elements, ~53.25 Mbits of on-chip RAM, and 600 I/Os makes it suitable for consolidating complex FPGA functions while minimizing external components.

Choose this device when your design priorities include dense logic integration, significant on-chip memory, and high I/O connectivity within a commercial temperature range and surface-mount package. Its package and electrical specifications support streamlined board-level integration and power planning.

Request a quote or submit an inquiry for pricing and availability to evaluate how 5SGXMB9R2H43C3N can fit into your next high-density FPGA design.