5SGXMB9R2H43C2LN

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 234 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB9R2H43C2LN – Stratix V GX FPGA, 840,000 logic elements

The 5SGXMB9R2H43C2LN is a Stratix® V GX field-programmable gate array supplied in a 1760-BBGA FCBGA package. It integrates a large logic fabric and on-chip memory with up to 600 I/Os, targeting complex, high-density digital designs in commercial-temperature applications.

With approximately 840,000 logic elements and roughly 53.248 Mbits of embedded memory, this device is specified for 0 °C to 85 °C operation and RoHS compliance, and operates from a core voltage range of 820 mV to 880 mV.

Key Features

  • Core & logic capacity  Approximately 840,000 logic elements, enabling substantial user logic integration for large-scale FPGA designs.
  • Embedded memory  Approximately 53.248 Mbits of on-chip RAM to support buffering, caching, and state retention without external memory for many functions.
  • I/O density  Up to 600 I/Os to support wide parallel interfaces, multiple peripherals, and complex board-level routing.
  • Package & mounting  1760-BBGA FCBGA package (supplier device package: 1760-HBGA, 45×45) with surface-mount mounting type for compact board integration.
  • Power  Core supply voltage specified between 820 mV and 880 mV to match system power-rail planning and design constraints.
  • Operating grade & temperature  Commercial-grade device rated for operation from 0 °C to 85 °C.
  • Regulatory  RoHS compliant, supporting lead-free manufacturing and environmental requirements.

Unique Advantages

  • High logic integration: 840,000 logic elements provide the capacity to consolidate large digital subsystems into a single FPGA, reducing board-level complexity.
  • Significant on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • Large I/O complement: 600 I/Os enable flexible interfacing to a wide range of peripherals and parallel data paths.
  • Compact FCBGA package: The 1760-BBGA (1760-HBGA, 45×45) package offers a high I/O and logic density footprint suitable for space-constrained boards.
  • Commercial-temperature readiness: Rated for 0 °C to 85 °C operation, suitable for standard commercial electronic products and systems.
  • RoHS compliance: Facilitates conformity with environmental and manufacturing directives for lead-free assembly.

Why Choose 5SGXMB9R2H43C2LN?

The 5SGXMB9R2H43C2LN brings together a substantial logic fabric, large embedded memory, and a high I/O count in a single commercial-grade Stratix V GX FPGA package. These explicit attributes make it well suited for designers consolidating complex digital functions, implementing heavy memory buffering, or requiring broad interfacing in a compact surface-mount form factor.

Its defined operating voltage range, commercial temperature rating, and RoHS compliance provide clear, verifiable parameters for system power planning, thermal design, and regulatory alignment during product development and manufacturing.

Request a quote or submit a product inquiry to receive pricing, availability, and ordering information for the 5SGXMB9R2H43C2LN.

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