5SGXMB9R2H43C2N

The 5SGXMB9R2H43C2N is a Stratix V GX family FPGA offering a high-density programmable fabric with 840,000 logic elements and approximately 53 Mbits of embedded memory. This surface-mount FCBGA device provides up to 600 user I/Os and is supplied in a 1760-BBGA (1760-HBGA, 45×45) package for high-pin-count designs.

Designed as a commercial-grade component (0 °C to 85 °C) with a low-voltage core supply range of 870 mV to 930 mV, the device is RoHS compliant and intended for designs that require large logic capacity, substantial on-chip RAM, and high I/O density.

Key Features

• Core / Logic Capacity 840,000 logic elements to implement large-scale programmable logic and complex custom architectures.
• Embedded Memory Approximately 53 Mbits of on-chip RAM to support memory-intensive functions and intermediate buffering.
• I/O Density Up to 600 I/O pins, enabling broad external connectivity and interfacing options for high-channel-count systems.
• Power / Supply Core supply voltage range of 870 mV to 930 mV for designs targeting the Stratix V core power envelope.
• Package & Mounting 1760-BBGA FCBGA (supplier package: 1760-HBGA 45×45) in a surface-mount form factor for compact, high-pin-count board implementations.
• Temperature & Grade Commercial temperature grade rated for 0 °C to 85 °C operation.
• Regulatory / Environmental RoHS compliant.

Typical Applications

• High-density logic systems — Implement large programmable logic designs that require extensive logic element resources.
• Memory-intensive processing — Use the device's approximately 53 Mbits of embedded RAM for buffering, packet handling, and on-chip data storage.
• High-I/O platforms — Leverage up to 600 I/Os for multi-channel interfaces, custom front-end connectivity, or large peripheral arrays.
• Custom accelerator designs — Deploy the large logic and memory resources to build application-specific accelerators within a single FPGA package.

Unique Advantages

• Large programmable capacity: 840,000 logic elements reduce the need for multi-device partitions in complex designs.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM supports local data storage and high-throughput buffering without external memory dependence.
• High I/O count: 600 user I/Os enable broad external connectivity and flexible system-level integration.
• Compact, high-pin-count package: 1760-BBGA (1760-HBGA 45×45) provides dense signal routing in a surface-mount footprint.
• Commercial temperature grade: Rated 0 °C–85 °C for standard commercial applications and environments.
• Regulatory compliance: RoHS compliant for environmentally conscious designs.

Why Choose 5SGXMB9R2H43C2N?

The 5SGXMB9R2H43C2N positions itself as a high-density Stratix V GX FPGA tailored for designs that demand large logic capacity, abundant embedded memory, and extensive I/O. Its combination of 840,000 logic elements, roughly 53 Mbits of on-chip RAM, and up to 600 I/Os makes it suitable for single-device implementations of complex, memory-heavy functions.

With a commercial temperature rating, a compact 1760-BBGA package, and RoHS compliance, this device provides a scalable platform for engineers building dense, high-function-count programmable systems while maintaining a compact board footprint.

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