5SGXMB9R2H43C2LG

The 5SGXMB9R2H43C2LG is a Stratix® V GX field programmable gate array (FPGA) by Intel, offering a high-density programmable fabric for complex digital designs. It combines a large logic capacity with substantial on-chip memory and a broad I/O count in a compact surface-mount BBGA package.

Designed for commercial temperature-range systems, this device provides designers with the resources needed for demanding applications that require many logic elements, numerous I/Os, and significant embedded memory while maintaining industry-standard RoHS compliance.

Key Features

• Core Logic Capacity  Approximately 840,000 logic elements to implement large-scale digital logic, state machines, and custom accelerators.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM (53,248,000 bits) for buffering, FIFOs, and in-system data storage.
• I/O Count & Interfaces  Up to 600 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount design suited for dense PCBs.
• Power Requirements  Core voltage supply range of 820 mV to 880 mV to match system power-rail design.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic capacity and on-chip RAM to implement complex processing pipelines and custom compute blocks.
• Networking and communications  Multiple I/Os allow integration of wide parallel interfaces and board-level connectivity required in communication platforms.
• Prototyping and system integration  Compact BBGA packaging and surface-mount mounting make the device suitable for advanced prototype and production boards where PCB area and signal routing are considerations.

Unique Advantages

• High logic density: Enables consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 53 Mbits of RAM supports large buffers and on-chip data structures, minimizing external memory dependence.
• Extensive I/O availability: 600 I/Os provide design flexibility for interfacing with numerous peripherals and parallel buses.
• Compact package: 1760-BBGA FCBGA package offers a high-pin-count solution in a compact 45×45 supplier package footprint for dense board layouts.
• Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• Regulatory-friendly: RoHS compliance supports environmentally regulated product designs.

Why Choose 5SGXMB9R2H43C2LG?

The 5SGXMB9R2H43C2LG positions itself as a high-capacity, commercial-grade Stratix V GX device tailored for designs that require extensive programmable logic, sizable embedded memory, and a large number of I/Os in a compact surface-mount package. Its electrical and packaging specifications make it suitable for complex board-level FPGA implementations where integration density and on-chip resources are primary design drivers.

Backed by the Stratix V device documentation from the manufacturer, this FPGA is a practical choice for teams developing advanced digital systems that demand scalability and a well-documented device family.

If you need pricing, availability, or a formal quote for 5SGXMB9R2H43C2LG, submit a request today to receive a quote or further procurement details.