5SGXMB9R1H43I2G

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 577 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB9R1H43I2G – Stratix V GX FPGA, 840,000 logic elements

The 5SGXMB9R1H43I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, featuring a high-density programmable logic fabric and extensive on-chip memory. This device is configured for systems that require large logic capacity, substantial embedded RAM, and a broad set of I/O resources within a 1760‑BBGA FCBGA package.

Targeted use includes demanding industrial and high-performance designs that benefit from high logic element count, large embedded memory, and wide operating temperature capability.

Key Features

  • High Logic Density  840,000 logic elements to implement large-scale custom hardware functions and complex datapaths.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffers, FIFOs, and fast local storage.
  • Extensive I/O  600 I/O pins to support complex board-level interfacing and multiple parallel or serial connections.
  • Core Voltage  Core supply range from 870 mV to 930 mV to meet specified operating conditions.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to support extended-temperature applications.
  • Package & Mounting  1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45). Surface‑mount design for compact board layouts.
  • Compliance  RoHS compliant to meet standard environmental requirements.

Typical Applications

  • High‑density compute and acceleration  Use the large logic element count and on‑chip RAM to implement custom accelerators and complex datapath logic.
  • Industrial control and automation  Industrial temperature rating and robust I/O make the device suited for controls, motor drives, and factory-automation systems.
  • High‑I/O systems  With 600 I/Os and a compact package, the device supports boards requiring many external interfaces or parallel data channels.

Unique Advantages

  • Highly integrated logic capacity: 840,000 logic elements reduce the need for multiple devices and simplify system architecture.
  • Substantial embedded memory: Approximately 53.25 Mbits of RAM enables on-chip buffering and low-latency data handling without external memory.
  • Robust industrial operation: −40 °C to 100 °C rating provides stability across extended operating environments.
  • Wide I/O count in a compact package: 600 I/Os in a 1760‑BBGA footprint allow dense connectivity while keeping board area under control.
  • Low-voltage core operation: 870–930 mV core supply supports the device’s specified operating conditions and power design planning.
  • RoHS compliance: Aligns with common environmental and regulatory requirements for modern electronic systems.

Why Choose 5SGXMB9R1H43I2G?

The 5SGXMB9R1H43I2G positions itself where high logic density, abundant embedded memory, and extensive I/O converge in a single Stratix V GX FPGA. Its combination of 840,000 logic elements, approximately 53.25 Mbits of on‑chip RAM, and 600 I/Os make it suitable for demanding industrial and high‑performance designs that require integration and thermal robustness.

As part of the Stratix V family from Intel, this device is supported by Stratix V device documentation and datasheets, offering clear electrical and operating parameters to guide system design, power budgeting, and board integration for long‑term deployment.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for 5SGXMB9R1H43I2G.

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