5SGXMB9R1H43C2LG

The 5SGXMB9R1H43C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering a large programmable fabric and extensive I/O in a high-pin-count BGA package. It delivers substantial on-chip memory and logic capacity for designs that require dense, reconfigurable logic, high I/O connectivity, and integrated embedded RAM.

Configured as a commercial-grade Stratix V GX device, this part is specified for operation from 0 °C to 85 °C and supports a core supply range of 820–880 mV. The device is RoHS compliant and provided in a surface-mount BGA packaging option.

Key Features

• Core Logic Capacity  840,000 logic elements provide extensive programmable resources for large-scale custom logic and complex FPGA implementations.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive IP blocks.
• I/O Density  600 user I/Os for high-pin-count designs requiring multiple interfaces, parallel buses, or dense signal routing.
• Power Supply  Core voltage supply specified between 820 mV and 880 mV.
• Package & Mounting  Available in a 1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting type for modern PCB assembly.
• Temperature & Grade  Commercial grade, rated for operation from 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for environmentally conscious manufacturing and supply chains.

Typical Applications

• High-density programmable systems  Leverage the large logic element count for complex custom logic, compute engines, and control fabrics.
• I/O-intensive interfaces  Use the 600 I/Os to implement multiple parallel interfaces, bridging functions, or dense port aggregation.
• Memory-dependent designs  Employ the approximately 53.25 Mbits of embedded RAM for buffering, packet handling, or intermediate data storage.
• Embedded and server-class boards  Integrate the device in surface-mount BGA designs where high integration and pin density are required.

Unique Advantages

• High logic capacity: 840,000 logic elements enable large, complex designs without partitioning across multiple FPGAs.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependence and simplifies board design.
• Extensive I/O resources: 600 user I/Os support multi-interface designs and high channel counts on a single device.
• Compact BGA packaging: 1760-ball BGA (1760-HBGA supplier package) offers a high pin count in a compact surface-mount form factor.
• Commercial temperature rating: 0 °C to 85 °C aligns with mainstream deployment environments.
• RoHS compliant: Facilitates environmentally compliant manufacturing and distribution.

Why Choose 5SGXMB9R1H43C2LG?

The 5SGXMB9R1H43C2LG positions itself as a high-capacity Stratix V GX FPGA option for designs that require a large programmable fabric, significant embedded memory, and broad I/O connectivity in a single, surface-mount BGA package. Its commercial temperature rating, RoHS compliance, and clearly specified core voltage range make it suitable for mainstream embedded and board-level applications where integration density and on-chip resources matter.

Engineers designing systems that consolidate complex logic, large buffering needs, and many interfaces onto a single device will find the combination of 840,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 600 I/Os advantageous. Refer to the Stratix V device documentation for detailed electrical and switching characteristics when integrating this device into your design.

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