5SGXMB6R3F43I4N

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA

Quantity 216 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R3F43I4N – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMB6R3F43I4N is a Stratix® V GX FPGA offering very high logic density and large on‑chip memory in a 1760‑FCPBGA package. Designed for industrial temperature operation, this device targets designs that require extensive programmable logic, abundant embedded RAM, and a high pin count for complex I/O connectivity.

Key value comes from its combination of approximately 597,000 logic elements, about 53.25 Mbits of embedded memory, and 600 I/O pins, enabling integration of dense digital logic and memory structures in a single device while supporting industrial temperature ranges and RoHS compliance.

Key Features

  • Core Logic  Approximately 597,000 logic elements and 225,400 logic blocks provide substantial programmable logic resources for high-density digital designs.
  • Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM for large buffers, FIFOs, and data‑path storage without external memory.
  • I/O Capacity  600 general‑purpose I/O pins to support wide bus interfaces, multi‑lane connectivity, and extensive peripheral integration.
  • Transceiver Capability (series)  Stratix V GX devices in this family include high‑speed transceiver options; refer to series documentation for supported channel rates and speed grades.
  • Power Supply  Core voltage supply range of 820 mV to 880 mV for the device core power domain.
  • Package & Mounting  1760‑FBGA (1760‑FCBGA) package, 42.5 mm × 42.5 mm, surface‑mount for dense board integration.
  • Temperature & Reliability  Industrial grade operation with an ambient temperature range of −40 °C to 100 °C and RoHS compliant manufacturing.

Typical Applications

  • High‑density digital signal processing  Use the large logic capacity and embedded RAM for filtering, modulation/demodulation, and real‑time data manipulation.
  • Network and packet processing  High I/O count and series transceiver options support multi‑lane interfaces and packet buffering for switching and routing tasks.
  • Compute acceleration and dataflow  Leverage abundant logic elements and on‑chip memory to implement custom accelerators and data‑path pipelines.
  • Industrial control and instrumentation  Industrial temperature rating and extensive I/O make the device suitable for demanding control systems and measurement equipment.

Unique Advantages

  • Substantial programmable logic: The large population of logic elements and logic blocks lets you consolidate complex digital functions on a single device, reducing system BOM.
  • Extensive embedded memory: Approximately 53.25 Mbits of on‑chip RAM reduces dependence on external memory for buffering and state storage.
  • High I/O density: 600 I/O pins enable broad peripheral connectivity and parallel interfacing without additional I/O expanders.
  • Industrial temperature operation: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature‑variable environments.
  • RoHS compliant: Conforms to lead‑free manufacturing requirements for regulatory and environmental compatibility.
  • Compact high‑pin package: 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package balances I/O count with board space efficiency.

Why Choose 5SGXMB6R3F43I4N?

The 5SGXMB6R3F43I4N positions itself as a high‑density Stratix V GX FPGA option for developers who need extensive logic, sizeable embedded memory, and large I/O counts within an industrial temperature envelope. Its combination of approximately 597k logic elements, roughly 53.25 Mbits of on‑chip RAM, and 600 I/Os makes it well suited for complex dataflow, networking, and real‑time processing applications that demand integration and reliability.

For teams building scalable, robust systems, this device delivers integration savings and design headroom while remaining compliant with RoHS standards and supported across the Stratix V documentation set.

Request a quote or submit your project details to receive pricing and availability for the 5SGXMB6R3F43I4N. Our team can assist with lead times, volume pricing, and ordering information to support your design cycle.

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