5SGXMB6R3F43I3N

The 5SGXMB6R3F43I3N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel. It delivers a high-capacity programmable logic fabric with a large embedded memory footprint and a substantial I/O complement for complex, high-density designs.

Key strengths include approximately 597,000 logic elements, roughly 53 Mbits of embedded RAM, and up to 600 I/O pins, all packaged in a 1760‑FCBGA (42.5 × 42.5 mm) surface-mount package and rated for industrial temperatures (−40 °C to 100 °C).

Key Features

• Logic Capacity  Approximately 597,000 logic elements to support large-scale programmable logic and complex digital designs.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM for high-throughput buffering, look-up tables, and state storage.
• I/O Density  Up to 600 I/O pins to accommodate extensive peripheral, interface, and board-level connectivity.
• Package  1760‑FCBGA (42.5 × 42.5 mm) surface-mount package for high-pin-count system integration.
• Power Supply  Core voltage range specified at 820 mV to 880 mV to match low-voltage core domains.
• Operating Temperature & Grade  Industrial temperature range of −40 °C to 100 °C; device is specified as Industrial grade.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Leverage ~597k logic elements and abundant embedded RAM for large-scale digital designs and customizable processing pipelines.
• High-I/O interface hubs  Use up to 600 I/Os to implement multi-protocol bridging, dense peripheral aggregation, or board-level I/O routing.
• Industrial equipment and controls  Industrial temperature rating (−40 °C to 100 °C) supports deployment in harsh-environment control and automation systems.
• Memory-intensive functions  Approximately 53 Mbits of on-chip RAM supports buffering, packet processing, and local data storage needs.

Unique Advantages

• High integration density: Nearly 597,000 logic elements reduce the need for multiple devices when implementing complex logic and state machines.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory enables large local buffers and latency-sensitive data paths without external memory.
• Extensive I/O capability: Up to 600 I/Os provide flexibility for mixed-signal front ends, multiple high-speed interfaces, and dense connector assemblies.
• Industrial temperature rating: −40 °C to 100 °C operating range meets the thermal requirements of many industrial and outdoor systems.
• Compact high-pin-count package: 1760‑FCBGA (42.5 × 42.5 mm) enables high-density board layouts while keeping the device in a single-package solution.
• Low-voltage core domain: 820–880 mV supply range supports designs targeting reduced core power consumption.

Why Choose 5SGXMB6R3F43I3N?

The 5SGXMB6R3F43I3N positions itself as a high-capacity Stratix V GX FPGA option for designs that require large programmable logic resources, significant on-chip memory, and a high I/O count in an industrial-rated package. Its combination of logic capacity, embedded RAM, and 600 I/Os supports complex system integration while the 1760‑FCBGA footprint simplifies high-density board design.

Backed by Intel's Stratix V family documentation, this device is well suited to teams building scalable, performance-focused programmable systems that demand reliable operation across a wide temperature range.

Request a quote or submit your specifications to receive pricing and availability for the 5SGXMB6R3F43I3N Stratix V GX FPGA.