5SGXMB6R3F43I3LG

The 5SGXMB6R3F43I3LG is a Stratix® V GX field programmable gate array (FPGA) from Intel, supplied in a 1760‑FCBGA (42.5 × 42.5 mm) package and rated for industrial operation. Designed for designs that demand very large logic capacity, substantial embedded memory, and a high I/O count, this device delivers a compact, surface‑mount FPGA option with robust operating range and RoHS compliance.

Key Features

• Logic Capacity  Approximately 597,000 logic elements, providing high integration density for complex digital designs.
• Embedded Memory  Approximately 53 Mbits of on‑chip RAM for large buffering, state storage, and memory‑intensive functions.
• I/O Density  600 user I/O pins to support high‑pin‑count interfaces and multiple parallel connections.
• Package & Mounting  1760‑FBGA (1760‑FCBGA) package in a 42.5 × 42.5 mm footprint; surface‑mount for compact PCB integration.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match system power‑rail requirements.
• Temperature & Grade  Industrial grade with an operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density digital processing  Leverage the large logic element count and embedded RAM for complex custom compute and signal‑processing blocks on a single FPGA.
• Multi‑interface systems  Use the 600 I/O pins to implement multiple parallel and serial interfaces without external IO expanders.
• Industrial control and automation  Industrial temperature rating and robust power supply range enable deployment in factory, instrumentation, and control systems.

Unique Advantages

• High integration density: 597,000 logic elements reduce the need for multiple devices and simplify board-level design.
• Substantial on‑chip memory: Approximately 53 Mbits of embedded RAM supports large data buffers and state storage without external memory.
• Large I/O complement: 600 I/O pins give designers flexibility to connect numerous peripherals and high‑speed interfaces directly.
• Industrial robustness: −40 °C to 100 °C operating range suits demanding environments where temperature stability matters.
• Compact, manufacturable package: 1760‑FCBGA surface‑mount package (42.5 × 42.5 mm) enables high‑density PCB layouts and automated assembly.
• Regulatory compliance: RoHS compliance supports environmental and supply‑chain requirements.

Why Choose 5SGXMB6R3F43I3LG?

The 5SGXMB6R3F43I3LG positions itself where substantial logic capacity, significant embedded memory, and a high I/O count are required in a single, industrial‑rated FPGA package. Its combination of approximately 597,000 logic elements, roughly 53 Mbits of on‑chip RAM, and 600 I/O pins provides designers with a highly integrated building block for complex, space‑constrained systems.

For engineering teams developing demanding industrial or high‑density digital designs, this Stratix V GX device offers a balance of performance, integration, and environmental resilience, backed by Intel's Stratix V device family documentation and specifications.

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