5SGXMB6R3F43C3N

The 5SGXMB6R3F43C3N is a Stratix V GX Field Programmable Gate Array (FPGA) offered in a 1760-FCBGA package. It provides a high logic capacity device with a large embedded memory and extensive I/O for demanding commercial applications.

Designed for commercial temperature operation, this Stratix V GX device targets complex digital designs that require significant on-chip resources, a high I/O count, and a compact surface-mount package footprint.

Key Features

• Core Logic  597,000 logic elements (logic element cells) for implementing complex digital functions and large-scale logic designs.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support large buffering, lookup tables, and memory-intensive algorithms.
• I/O Capacity  600 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count system integration.
• Package  1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high-density board integration and board-level routing flexibility.
• Power Supply  Core voltage supply range of 820 mV to 880 mV, enabling defined core-power provisioning for system power budgeting.
• Operating Range  Commercial-grade operating temperature range of 0 °C to 85 °C suitable for standard commercial electronics environments.
• RoHS Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• High‑Performance Computing Accelerators  Use the large logic capacity and abundant on-chip RAM to implement custom compute kernels and data-path acceleration.
• Network Infrastructure  Support packet processing, protocol offload, and wide-interface networking designs with the high I/O count and on-chip resources.
• Signal Processing  Implement DSP pipelines, large FIR/IIR filters, and real-time data processing where substantial logic and memory are required.
• Prototyping and Platform Development  Ideal for development platforms and complex FPGA-based prototypes that require scalable logic and dense I/O.

Unique Advantages

• High logic density: 597,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 53.248 Mbits of on-chip RAM reduces external memory dependencies and simplifies board design.
• Extensive I/O: 600 I/Os provide flexibility for interfacing to high-pin-count peripherals and wide parallel buses.
• Compact, manufacturable package: 1760-FCBGA surface-mount package offers a high-density footprint compatible with standard PCB assembly processes.
• Commercial temperature grade: Rated for 0 °C to 85 °C, matching typical commercial system deployment requirements.
• Regulatory readiness: RoHS-compliant device construction supports environmentally constrained manufacturing flows.

Why Choose 5SGXMB6R3F43C3N?

The 5SGXMB6R3F43C3N combines a very large logic element count, significant embedded memory, and a high I/O count in a single commercial-grade FCBGA package. This balance of resources and package density makes it suitable for teams developing compute- and I/O-intensive FPGA designs where on-chip capacity and integration matter.

Choose this Stratix V GX device when your design requires scalable logic resources, ample on-chip RAM to minimize external memory, and extensive I/O in a surface-mount 1760-FCBGA form factor — all within a commercial temperature envelope and RoHS-compliant construction.

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