5SGXMB6R3F43C2LG

The 5SGXMB6R3F43C2LG is a Stratix® V GX field programmable gate array (FPGA) from Intel. It delivers large on-chip logic and memory resources in a 1760-ball FCBGA package for commercial applications that require substantial I/O and embedded RAM.

Designed as part of the Stratix V GX family, this device is specified with the electrical and switching characteristics described in the Stratix V device datasheet and is targeted at system designs that demand high logic capacity, extensive I/O count, and controlled core voltage operation.

Key Features

• Logic Capacity — Approximately 597,000 logic elements provide significant fabric for complex digital designs and large custom logic implementations.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, large FIFOs, and memory-intensive processing functions.
• High I/O Count — 600 dedicated I/O pins to accommodate broad peripheral and subsystem interfacing needs.
• Power and Core Supply — Core voltage supply specified from 820 mV to 880 mV, enabling precise power domain design and system supply planning.
• Package — 1760-BBGA, FCBGA package (supplier device package: 1760-FCBGA, 42.5 × 42.5 mm) for dense board-level integration and routing.
• Mounting and Temperature — Surface-mount device offered in commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for regulatory and manufacturing alignment.
• Family-Level Characteristics — Part of the Stratix V GX family; refer to the Stratix V device datasheet for family electrical and transceiver specifications and speed-grade information.

Typical Applications

• High-density logic systems — Use the device where large numbers of logic elements and embedded RAM are required to implement complex custom processing or control functions.
• Multi-I/O interface hubs — The 600 I/Os make the device suitable for designs that need extensive peripheral aggregation and board-level routing.
• Memory-heavy FPGA designs — Approximately 53.25 Mbits of on-chip RAM supports large buffers, packet processing, and data staging directly in the fabric.

Unique Advantages

• High logic density: Approximately 597,000 logic elements enable consolidation of large designs into a single FPGA, reducing system complexity and component count.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and real-time data tasks.
• Large I/O capability: 600 I/Os simplify integration with multiple subsystems and reduce the need for external multiplexing or I/O expanders.
• Compact, manufacturable package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package supports high-density PCB layouts and automated assembly processes.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation, matching typical commercial application environments.
• Standards-aware compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMB6R3F43C2LG?

This Stratix V GX device brings together substantial logic capacity, significant on-chip memory, and a high I/O count in a single commercial-grade FCBGA package. It suits designs that require consolidation of complex digital logic and memory into one FPGA while maintaining a compact board footprint.

Backed by the Stratix V family documentation, the 5SGXMB6R3F43C2LG is appropriate for engineering teams and procurement groups seeking a high-capacity FPGA with clearly defined electrical, package, and operating specifications for commercial applications.

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