5SGXMB6R3F40I4G

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 1,155 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R3F40I4G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMB6R3F40I4G is a Stratix V GX family FPGA offering high logic capacity, abundant embedded memory, and extensive I/O for demanding designs. It is supplied in an industrial grade package and is intended for systems that need large programmable logic resources combined with robust operating range and a compact 1517-FBGA (40×40) package.

Key on‑device resources include approximately 597,000 logic elements, about 53.25 Mbits of on‑chip RAM, and 432 I/O pins, making this device appropriate for applications that require high gate density, significant on‑chip memory, and broad external connectivity.

Key Features

  • Core Capacity — Approximately 597,000 logic elements and 225,400 logic array blocks provide extensive programmable logic for large-scale designs.
  • Embedded Memory — Total on‑chip RAM of approximately 53.25 Mbits to support buffer, cache, and algorithmic storage needs without external memory.
  • I/O Density — 432 I/O pins to interface with numerous peripherals, sensors, or high‑pin-count boards.
  • Family Transceiver Options — As a Stratix V GX device, it belongs to a family that offers multiple transceiver speed grades (family-level information provided in the device datasheet).
  • Power Supply Range — Core voltage supply specified from 820 mV to 880 mV for the device core rails.
  • Package & Mounting — 1517‑FBGA (40×40) supplier device package with surface mount mounting for compact board integration.
  • Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • High‑density logic and control — Use the large logic element count to implement complex custom logic, control engines, and parallel processing blocks.
  • Memory‑heavy algorithms — Leverage approximately 53.25 Mbits of embedded RAM for data buffering, on‑chip caching, and state storage in compute‑intensive tasks.
  • High‑I/O systems — 432 I/O pins support designs that require extensive external interfacing, sensor arrays, or multi‑lane I/O architectures.
  • Industrial equipment — Industrial temperature rating (–40 °C to 100 °C) and surface‑mount packaging make this device suitable for industrial control and automation platforms.

Unique Advantages

  • Large programmable fabric: High logic element and logic array block counts reduce the need for multiple FPGAs or external glue logic, simplifying system architecture.
  • Significant on‑chip memory: Approximately 53.25 Mbits of RAM enables larger datasets and deeper buffering without immediate reliance on external memory devices.
  • Extensive external connectivity: 432 I/O pins provide flexibility for complex board-level designs and multi‑interface systems.
  • Industrial robustness: Rated for –40 °C to 100 °C operation to meet the needs of industrial deployments and harsher environments.
  • Compact high‑pin package: 1517‑FBGA (40×40) offers a high pin count in a compact form factor for space‑constrained designs.
  • Standards compliance: RoHS compliance supports environmental and regulatory requirements in many markets.

Why Choose 5SGXMB6R3F40I4G?

The 5SGXMB6R3F40I4G combines a large logic fabric, substantial embedded RAM, and a high I/O count within a compact 1517‑FBGA package and industrial temperature rating. This balance of resources makes it well suited to engineers and designers who need a single FPGA to handle complex, memory‑intensive, and I/O‑heavy designs while meeting industrial operating requirements.

Choosing this Stratix V GX device provides a scalable platform for sophisticated logic integration and long‑term deployment, with family‑level transceiver options and datasheet‑defined electrical and operating parameters to guide system design and qualification.

Request a quote or submit an inquiry to get pricing and availability for the 5SGXMB6R3F40I4G. Our team can provide procurement details and support for your design evaluation and production planning.

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