5SGXMB6R3F40I3G

The 5SGXMB6R3F40I3G is a Stratix V GX FPGA IC from Intel, delivered in a 1517‑FBGA (40×40) surface‑mount package. It combines high logic density, substantial on‑chip RAM, and extensive I/O to address designs that require large programmable fabric and broad interfacing capability.

Designed for industrial‑grade operation, this device provides a wide operating temperature range and a defined core voltage supply range, making it suitable for embedded and industrial applications that demand robustness and high integration.

Key Features

• Core density — 597,000 logic elements, providing significant programmable logic capacity for complex designs.
• Logic array blocks (LABs) — 225,400 LABs for organized, scalable implementation of large logic networks.
• Embedded memory — approximately 53.25 Mbits of on‑chip RAM to support data buffering, FIFOs, and on‑device storage.
• I/O capability — 432 user I/O pins to support wide external interfacing and multi‑channel connectivity.
• Package & mounting — 1517‑FBGA (40×40) package in a surface‑mount form factor for compact board integration.
• Power — specified core supply range of 820 mV to 880 mV for defined power design and sequencing.
• Temperature & grade — Industrial grade with operating temperature range of –40 °C to 100 °C for reliable operation in demanding environments.

Typical Applications

• High‑density signal processing — Implement large logic networks and on‑chip memory for DSP, packet processing, and algorithm acceleration.
• Industrial communication systems — Use plentiful I/O and industrial temperature rating for robust protocol bridging and interface aggregation.
• Prototyping and complex FPGA designs — Large logic and memory resources enable system validation and development of feature‑rich FPGA solutions.
• Data buffering and packet handling — Significant embedded RAM supports buffering, flow control, and temporary data storage on device.

Unique Advantages

• Substantial programmable fabric: 597,000 logic elements and 225,400 LABs support very large, complex designs without immediate device migration.
• Significant on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
• Extensive I/O: 432 I/O pins enable flexible interfacing with multiple peripherals, sensors, or high-density connectors.
• Industrial reliability: Rated for –40 °C to 100 °C operation to meet industrial deployment temperature requirements.
• Compact packaging: 1517‑FBGA (40×40) surface‑mount package balances high pin count with board‑space efficiency.
• Defined power envelope: Core supply range of 820 mV–880 mV aids predictable power budgeting and system integration.

Why Choose 5SGXMB6R3F40I3G?

The 5SGXMB6R3F40I3G delivers a combination of high logic density, large embedded memory, and broad I/O in an industrial‑grade Stratix V GX device. Its specifications make it well suited to engineers building complex, memory‑intensive FPGA systems that require reliable operation across a wide temperature range.

Backed by Intel’s Stratix V family documentation and silicon platform, this FPGA provides a scalable hardware foundation for long‑lifecycle projects where integration density and predictable electrical/thermal limits matter.

Request a quote or submit a pricing and availability inquiry to get lead‑time and ordering information for the 5SGXMB6R3F40I3G.