5SGXMB6R3F40C4N

The 5SGXMB6R3F40C4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offered in a 1517-FBGA (40×40) package. It provides a high-density programmable logic fabric with a significant complement of on-chip memory and a large I/O count for complex, I/O-intensive designs.

This commercial-grade device targets applications that require substantial logic capacity, embedded memory, and dense I/O integration while operating within a 0 °C to 85 °C temperature range and a core voltage supply of 820 mV to 880 mV.

Key Features

• Large Logic Capacity — 597,000 logic elements (cells) to implement complex digital designs and large-scale programmable logic functions.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive processing.
• High I/O Count — 432 user I/O pins for extensive peripheral, interface, and board-level connectivity.
• Stratix V GX Family Characteristics — Part of the Stratix V GX family; the device datasheet documents family-level electrical and switching characteristics, including transceiver and I/O timing details.
• Low-Voltage Core — Core supply range of 820 mV to 880 mV to support the device’s power architecture.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C to suit commercial-environment electronics.
• Package & Mounting — 1517-FBGA (40×40) supplier device package with surface-mount mounting type for PCB assembly.
• RoHS Compliant — Meets RoHS requirements for material compliance.

Typical Applications

• High-density digital processing — Implement complex logic and data-paths using the device’s large logic element count and substantial on-chip RAM.
• Communication and transceiver systems — Leverage the Stratix V GX family’s documented transceiver and switching characteristics for designs that require advanced I/O and link integration.
• Board-level systems with dense I/O — Utilize 432 I/O pins to interface with multiple peripherals, sensors, and external memory devices.
• Embedded systems and acceleration — Deploy the device where significant programmable logic and embedded memory are needed to accelerate specialized processing tasks.

Unique Advantages

• High integration density: 597,000 logic elements and ~53.248 Mbits of embedded RAM reduce the need for external logic and memory, simplifying system BOM.
• Extensive I/O capability: 432 I/O pins enable broad interfacing options for multi-channel and multi-peripheral designs.
• Commercial-grade deployment: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronics applications.
• FBGA package for compact assemblies: 1517-FBGA (40×40) surface-mount package supports compact PCB layouts and modern assembly processes.
• Stable core power window: Defined core supply range (820–880 mV) supports predictable power planning and system integration.
• RoHS compliant: Meets environmental material standards expected in regulated manufacturing environments.

Why Choose 5SGXMB6R3F40C4N?

The 5SGXMB6R3F40C4N delivers a combination of large programmable logic resources, substantial embedded memory, and a high I/O count in a compact 1517-FBGA package. Its commercial temperature rating and RoHS compliance make it suitable for cost-conscious, performance-oriented designs in communications, embedded acceleration, and dense I/O systems.

Engineers and designers who require significant on-chip logic and memory capacity along with extensive interfacing options will find this Stratix V GX device a practical choice for scalable, high-capacity FPGA implementations backed by the Stratix V family documentation of electrical and switching characteristics.

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